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NBSG72AMN

Onsemi

NBSG72AMN by Onsemi

NBSG72AMN by Onsemi is a 16-terminal cross point switch with a supply voltage range of +-2.5/+-3.3V, suitable for industrial applications. It features a compact square package style with a very thin profile and terminal pitch of 0.5mm, making it ideal for surface mount installations. With an operating temperature range from -40 to 85°C, this multiplexer offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,857 parts In-Stock

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Digiode

USA . 1,875 parts In-Stock

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1,875

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Prism Electronics

USA . 26 parts In-Stock

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26

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 776 parts In-Stock

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$3.500

100+ parts

$3.412

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$3.395

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776

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 441 parts In-Stock

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$4.500

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441

$4.500

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AZTECH Wire

Italy . 818 parts In-Stock

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$16.372

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818

$16.372

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Aztec Data Supply Inc.

USA . 830 parts In-Stock

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$23.890

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830

$23.890

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Problanco Electronics

Mexico . 7,538 parts In-Stock

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Microchip USA

USA . 7,377 parts In-Stock

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Continental Prestige Electronics

USA . 6,726 parts In-Stock

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Metaverse IC Inc.

Canada . 6,013 parts In-Stock

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Kulean Microsystems

USA . 5,779 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,589 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,690 parts In-Stock

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SupplyDigital Components

Austria . 2,514 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,803 parts In-Stock

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Corphita

USA . 1,383 parts In-Stock

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Perfect Parts

USA . 454 parts In-Stock

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Corohmni

South Africa . 444 parts In-Stock

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TANS Electronics

Latvia . 332 parts In-Stock

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UHIMA Technologies

Türkiye . 166 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Discover the Onsemi NBSG72AMN, a high-quality multiplexer and switch that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this versatile chip carrier with a very thin profile is perfect for a wide range of applications. With a nominal supply voltage of 2.5V and dual power supplies, it provides exceptional value and benefits to customers looking for seamless switching solutions. Upgrade your system with the NBSG72AMN and experience the advantages of superior quality and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and improving reliability.

Nominal Supply Voltage (Vsup): 2.5 V

Operates at a commonly used voltage level, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial applications.

No. of Channels: 2

Provides flexibility for routing signals and data between multiple sources.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for performance and reliability.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple packaging options for different installation requirements.

Technical Specifications

Multiplexers & Switches NBSG72AMN attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -2.375V TO -3.465V

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

NBSG72AMN Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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