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NBA3N5573MNTXG

Onsemi

NBA3N5573MNTXG by Onsemi

NBA3N5573MNTXG clock generator by Onsemi operates at a max output frequency of 200 MHz, suitable for industrial applications. It features a supply voltage range of 2.97V to 3.63V and has AEC-Q100 screening level certification, making it ideal for automotive electronics. This CMOS technology-based chip carrier with matte tin finish is designed for processor-specific clock generation in harsh environments.

Median Price

$3.510

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,955 parts In-Stock

1+ parts

$3.510

100+ parts

$2.187

1k+ parts

$1.948

10k+ parts

$1.878

1,955

$3.510

$2.187

$1.948

$1.878

Mouser Electronics

USA . 1,717 parts In-Stock

1+ parts

$3.510

100+ parts

$2.190

1k+ parts

$1.950

10k+ parts

$1.840

1,717

$3.510

$2.190

$1.950

$1.840

Chip1Stop

Japan . 2,860 parts In-Stock

1+ parts

$12.900

100+ parts

$5.310

1k+ parts

$3.400

10k+ parts

-

2,860

$12.900

$5.310

$3.400

-

Distributors (In-Stock)

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Digiode

USA . 2,337 parts In-Stock

1+ parts

$3.506

100+ parts

-

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2,337

$3.506

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Vyrian

USA . 2,475 parts In-Stock

1+ parts

$3.690

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2,475

$3.690

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Chip Stock

USA . 22,100 parts In-Stock

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22,100

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Nova Conductors

Japan . 750 parts In-Stock

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750

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ComSIT Distribution GmbH

Germany . 21 parts In-Stock

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21

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,776 parts In-Stock

1+ parts

$3.140

100+ parts

-

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2,776

$3.140

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-

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Corphita

USA . 1,964 parts In-Stock

1+ parts

$3.321

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1,964

$3.321

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Corohmni

South Africa . 174 parts In-Stock

1+ parts

$3.690

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174

$3.690

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Microchip USA

USA . 4,526 parts In-Stock

1+ parts

$12.656

100+ parts

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4,526

$12.656

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Modulus Dynamics

Lithuania . 368 parts In-Stock

1+ parts

$29.304

100+ parts

$29.304

1k+ parts

$29.304

10k+ parts

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368

$29.304

$29.304

$29.304

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Lixinc

USA . 14,344 parts In-Stock

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14,344

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Kulean Microsystems

USA . 4,668 parts In-Stock

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4,668

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TANS Electronics

Latvia . 4,460 parts In-Stock

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4,460

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Problanco Electronics

Mexico . 4,359 parts In-Stock

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4,359

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Continental Prestige Electronics

USA . 3,857 parts In-Stock

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3,857

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Argo Parts USA

USA . 2,204 parts In-Stock

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2,204

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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SupplyDigital Components

Austria . 1,769 parts In-Stock

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1,769

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UHIMA Technologies

Türkiye . 585 parts In-Stock

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585

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Overview

Elevate your electronics with the NBA3N5573MNTXG by Onsemi, a top-tier clock generator that delivers precision and reliability. Crafted by the renowned manufacturer Onsemi, this clock generator is ideal for a variety of applications, providing seamless synchronization and optimal performance. With a maximum output frequency of 200 MHz and AEC-Q100 screening level, this chip carrier boasts industrial-grade quality, ensuring longevity and efficiency. Say goodbye to timing issues and embrace seamless operation with the NBA3N5573MNTXG - the ultimate solution for your clock generation needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.63 V

Provides a wide operating voltage range for compatibility with various systems.

Screening Level: AEC-Q100

Meets automotive-grade standards, ensuring reliability in automotive applications.

Maximum Output Clock Frequency: 200 MHz

Offers high-frequency output for demanding clocking requirements.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions without performance degradation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and compatibility with modern systems.

Technical Specifications

Clock Generators NBA3N5573MNTXG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

25 MHz

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NBA3N5573MNTXG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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