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NB7L72MMNR2G

Onsemi

NB7L72MMNR2G by Onsemi

NB7L72MMNR2G by Onsemi is a 16-terminal cross point switch with power supplies of 2.5/3.3V, suitable for industrial applications. This surface-mount chip carrier operates in temperatures ranging from -40 to 85 °C, making it ideal for various multiplexing and switching tasks. With a compact square package shape and quad terminal position, it offers high performance in a small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,562 parts In-Stock

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Digiode

USA . 881 parts In-Stock

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TANS Electronics

Latvia . 7,309 parts In-Stock

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Corphita

USA . 2,449 parts In-Stock

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Problanco Electronics

Mexico . 1,219 parts In-Stock

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Kulean Microsystems

USA . 1,072 parts In-Stock

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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SupplyDigital Components

Austria . 827 parts In-Stock

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Corohmni

South Africa . 236 parts In-Stock

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Overview

Discover the innovative NB7L72MMNR2G by Onsemi, a top-quality cross point switch that delivers exceptional performance in a variety of applications. With a compact square package and industrial-grade temperature tolerance, this multiplexer offers reliability and efficiency. Ideal for telecommunications, networking, and test equipment, this chip carrier ensures seamless connectivity and optimal power supplies. Experience the advantages of Onsemi's cutting-edge technology with the NB7L72MMNR2G and elevate your projects to new heights of success.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs, making this product a convenient choice for compact electronic devices.

Package Shape: SQUARE

The square package shape offers better alignment and symmetry, making it easier to place and solder on the circuit board, ensuring better signal integrity.

Power Supplies (V): 2.5/3.3

Compatibility with multiple power supply voltages (2.5V and 3.3V) allows for flexible integration into various electronic systems, enhancing versatility.

No. of Terminals: 16

With 16 terminals, this multiplexer or switch can handle multiple input and output signals efficiently, enabling complex signal routing in electronic circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and protective housing for the IC, enhancing durability and reliability in harsh operating environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures stable performance even in elevated temperature conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, this product can withstand cold environments without compromising functionality, ideal for a wide range of operating conditions.

Terminal Position: QUAD

The quad terminal position allows for easy connections and routing of signals, simplifying the integration process and reducing the risk of signal interference.

Other IC type: CROSS POINT SWITCH

Being a cross-point switch IC type, this product offers versatile signal switching capabilities with minimal signal distortion, ensuring high-quality signal routing in electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets stringent temperature requirements and reliability standards, making it a robust choice for demanding environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and reduces the risk of lead contamination, contributing to environmental sustainability and ease of manufacturing.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product allows for high-density PCB layouts, enabling efficient use of space and improving overall system performance.

Technical Specifications

Multiplexers & Switches NB7L72MMNR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NB7L72MMNR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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