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NB3N206SDR2G

Onsemi

NB3N206SDR2G by Onsemi

NB3N206SDR2G by Onsemi is a Line Transceiver with 8 terminals, operating at 3.3V supply voltage and offering differential output. It has a max transmit delay of 2.4ns and can handle high-level input current up to 0.00001A. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$2.400

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,988 parts In-Stock

1+ parts

$2.400

100+ parts

$1.460

1k+ parts

$1.280

10k+ parts

$1.160

2,988

$2.400

$1.460

$1.280

$1.160

DigiKey

USA . 661 parts In-Stock

1+ parts

$2.400

100+ parts

$1.455

1k+ parts

$1.322

10k+ parts

-

661

$2.400

$1.455

$1.322

-

Chip1Stop

Japan . 2,280 parts In-Stock

1+ parts

$7.870

100+ parts

$3.290

1k+ parts

$2.050

10k+ parts

-

2,280

$7.870

$3.290

$2.050

-

Rochester

USA . 388,855 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.220

10k+ parts

$1.090

388,855

-

$1.470

$1.220

$1.090

Verical

USA . 223,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.525

10k+ parts

$1.363

223,658

-

-

$1.525

$1.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 603 parts In-Stock

1+ parts

$1.121

100+ parts

-

1k+ parts

-

10k+ parts

-

603

$1.121

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.245

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.245

-

-

-

Vyrian

USA . 99,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

99,353

-

-

-

-

Flip Electronics

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,000

-

-

-

-

Chip Stock

USA . 26,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 99,039 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

99,039

$1.000

-

-

-

Corphita

USA . 1,396 parts In-Stock

1+ parts

$1.062

100+ parts

-

1k+ parts

-

10k+ parts

-

1,396

$1.062

-

-

-

Corohmni

South Africa . 490 parts In-Stock

1+ parts

$1.180

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$1.180

-

-

-

Argo Parts USA

USA . 5,265 parts In-Stock

1+ parts

$1.245

100+ parts

-

1k+ parts

-

10k+ parts

-

5,265

$1.245

-

-

-

Continental Prestige Electronics

USA . 3,584 parts In-Stock

1+ parts

$1.245

100+ parts

-

1k+ parts

-

10k+ parts

$1.220

3,584

$1.245

-

-

$1.220

Microchip USA

USA . 4,585 parts In-Stock

1+ parts

$7.878

100+ parts

-

1k+ parts

-

10k+ parts

-

4,585

$7.878

-

-

-

Perfect Parts

USA . 13,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,785

-

-

-

-

TANS Electronics

Latvia . 7,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,637

-

-

-

-

Problanco Electronics

Mexico . 7,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,575

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,946

-

-

-

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Kulean Microsystems

USA . 4,299 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,299

-

-

-

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SupplyDigital Components

Austria . 2,915 parts In-Stock

1+ parts

-

100+ parts

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2,915

-

-

-

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Kepictronics

USA . 2,680 parts In-Stock

1+ parts

-

100+ parts

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2,680

-

-

-

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Futuretech Components

Singapore . 708 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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708

-

-

-

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UHIMA Technologies

Türkiye . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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463

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.183

10k+ parts

$1.158

100

-

$1.220

$1.183

$1.158

Overview

Experience the seamless performance and reliability of the NB3N206SDR2G by Onsemi, a leading manufacturer in the industry. This Line Driver & Receiver offers unparalleled quality and precision, making it perfect for a wide range of applications. With its innovative design and advanced features, this product ensures fast and efficient data transmission while maintaining low power consumption. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NB3N206SDR2G and experience the difference in performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable enables easy and efficient installation on PCBs, saving space and allowing for automated assembly processes.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB real estate and easy integration into existing designs.

Maximum Transmit Delay: 2.4 ns

The low transmit delay of 2.4 ns ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes integration with existing systems seamless and convenient.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components and allows for versatile circuit designs.

Width: 3.9 mm

The compact width of 3.9 mm allows for high-density PCB layouts and space-saving designs.

Maximum Output Low Current: 8 Amp

The high maximum output low current of 8A ensures compatibility with a wide range of loads and enhances reliability.

Differential Output: YES

Differential output helps in reducing noise and crosstalk, improving signal integrity and overall performance.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The use of a differential Schmitt trigger for input characteristics helps in providing hysteresis and noise immunity, ensuring reliable operation in noisy environments.

Interface Standard: EIA-899; TIA-899

Compliance with EIA-899 and TIA-899 interface standards ensures interoperability and compatibility with industry-standard communication protocols.

Technical Specifications

Line Drivers & Receivers NB3N206SDR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.05 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.4 ns

Width:

3.9 mm

Trade Compliance

NB3N206SDR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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