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NB3N200SDR2G

Onsemi

NB3N200SDR2G by Onsemi

NB3N200SDR2G by Onsemi is a line driver with 8 terminals, operating at 3.3V supply voltage and offering differential output. It has a max transmit delay of 2.4ns, making it suitable for industrial applications requiring fast signal transmission over short distances. With a small outline package style and dual terminal position, this device is ideal for surface mount designs in temperature-sensitive environments.

Median Price

$2.418

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,743 parts In-Stock

1+ parts

$3.170

100+ parts

$2.000

1k+ parts

-

10k+ parts

$1.650

1,743

$3.170

$2.000

-

$1.650

Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.667

12,500

-

-

-

$1.667

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 968 parts In-Stock

1+ parts

$1.458

100+ parts

-

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-

10k+ parts

-

968

$1.458

-

-

-

Digiode

USA . 197 parts In-Stock

1+ parts

$2.964

100+ parts

-

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197

$2.964

-

-

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Flip Electronics

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

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12,500

-

-

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-

Chip Stock

USA . 3,409 parts In-Stock

1+ parts

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3,409

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 97 parts In-Stock

1+ parts

$1.458

100+ parts

-

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97

$1.458

-

-

-

Corphita

USA . 1,449 parts In-Stock

1+ parts

$2.808

100+ parts

-

1k+ parts

-

10k+ parts

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1,449

$2.808

-

-

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Microchip USA

USA . 5,125 parts In-Stock

1+ parts

$10.691

100+ parts

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1k+ parts

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10k+ parts

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5,125

$10.691

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$12.851

100+ parts

$11.694

1k+ parts

$10.538

10k+ parts

-

200

$12.851

$11.694

$10.538

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SupplyDigital Components

Austria . 8,154 parts In-Stock

1+ parts

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8,154

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Kulean Microsystems

USA . 3,639 parts In-Stock

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3,639

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Problanco Electronics

Mexico . 2,945 parts In-Stock

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2,945

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Kepictronics

USA . 1,909 parts In-Stock

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1,909

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TANS Electronics

Latvia . 1,741 parts In-Stock

1+ parts

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1,741

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Futuretech Components

Singapore . 708 parts In-Stock

1+ parts

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708

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UHIMA Technologies

Türkiye . 201 parts In-Stock

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201

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Overview

Enhance your communication systems with the NB3N200SDR2G by Onsemi, a top-quality line driver & receiver designed for maximum performance. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust in the reliability and durability of this product. Ideal for a wide range of applications, this small outline package offers fast transmit and receive speeds, low power consumption, and differential outputs for seamless data transmission. Upgrade your systems today with the NB3N200SDR2G and experience enhanced connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage provides more flexibility in power input options for the product.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy to work with in terms of placement and alignment on circuit boards.

Maximum Transmit Delay: 2.4 ns

Low transmit delay ensures quick and efficient data transmission, making the product suitable for high-speed communication applications.

Power Supplies (V): 3.3

Standard power supply voltage of 3.3V is commonly used in electronics, ensuring compatibility with a wide range of devices.

No. of Terminals: 8

Having 8 terminals provides enough connection points for various components and ensures reliable connectivity.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and is ideal for compact electronic devices.

Maximum High Level Input Current: 0.00001 Amp

Low high level input current minimizes power consumption and heat generation, contributing to energy efficiency.

Minimum Supply Voltage: 2.97 V

Having a low minimum supply voltage ensures the product can operate effectively even with lower power input.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the product suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function reliably in cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and excellent solderability, ensuring long-term reliability of connections.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options and facilitates versatile installation.

Maximum Seated Height: 1.75 mm

Low seated height profile saves space on the circuit board and is suitable for slim electronic devices.

Width: 3.9 mm

Compact width dimension makes the product suitable for applications where space is limited.

Maximum Output Low Current: 8 Amp

High output low current capability allows for driving power to connected devices efficiently and reliably.

Differential Output: YES

Differential output helps in reducing common-mode noise and improving signal integrity, making the product suitable for noise-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

Having a maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly without damaging the components.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand typical reflow soldering processes without adverse effects.

Length: 4.9 mm

Compact length dimension makes the product suitable for applications where limited space is available for installation.

Minimum Out Swing: 2 V

Having a minimum output swing of 2V ensures proper signal amplitude for effective communication with connected devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade means the product is designed to withstand harsh environmental conditions, suitable for industrial applications.

Maximum Receive Delay: 6 ns

Low receive delay ensures quick processing of incoming data, making the product suitable for high-speed communication systems.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Interface Standard: EIA-899; TIA-899

Compliance with EIA/EIA and TIA standards ensures interoperability with other compatible devices and systems.

Maximum Supply Current: 24 mA

Low maximum supply current consumption helps in reducing power usage and prolonging battery life in portable electronic devices.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input ensures noise-immune and accurate signal detection, enhancing data reliability.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and reliable power supply for the product's operation.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact design and saves space on the circuit board, suitable for miniaturized electronic devices.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type facilitates communication between different systems and ensures data exchange with compatibility.

Technical Specifications

Line Drivers & Receivers NB3N200SDR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.4 ns

Width:

3.9 mm

Trade Compliance

NB3N200SDR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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