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NB3N206SDG

Onsemi

NB3N206SDG by Onsemi

NB3N206SDG by Onsemi is a line driver with 8 terminals, operating at 3.3V supply voltage and offering differential output. It features a max transmit delay of 2.4ns and can handle up to 24mA supply current. Ideal for industrial applications requiring fast signal transmission over short distances.

Median Price

$1.370

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 8 parts In-Stock

1+ parts

$0.898

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$0.898

-

-

-

Chip1Stop

Japan . 9 parts In-Stock

1+ parts

$1.370

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$1.370

-

-

-

Rochester

USA . 147,729 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.200

10k+ parts

$1.070

147,729

-

$1.440

$1.200

$1.070

Verical

USA . 132,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.337

132,776

-

-

$1.500

$1.337

DigiKey

USA . 39,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.790

10k+ parts

-

39,494

-

-

$0.790

-

Flip Electronics (Authorized)

USA . 39,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,494

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,324 parts In-Stock

1+ parts

$0.865

100+ parts

-

1k+ parts

-

10k+ parts

-

2,324

$0.865

-

-

-

Vyrian

USA . 1,284 parts In-Stock

1+ parts

$0.989

100+ parts

-

1k+ parts

-

10k+ parts

-

1,284

$0.989

-

-

-

Chip Stock

USA . 65,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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65,000

-

-

-

-

Flip Electronics

USA . 39,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,494

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,453 parts In-Stock

1+ parts

$0.820

100+ parts

-

1k+ parts

-

10k+ parts

-

1,453

$0.820

-

-

-

Corohmni

South Africa . 169 parts In-Stock

1+ parts

$0.989

100+ parts

-

1k+ parts

-

10k+ parts

-

169

$0.989

-

-

-

Continental Prestige Electronics

USA . 148,329 parts In-Stock

1+ parts

-

100+ parts

$1.140

1k+ parts

-

10k+ parts

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148,329

-

$1.140

-

-

Kulean Microsystems

USA . 7,587 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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7,587

-

-

-

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SupplyDigital Components

Austria . 6,731 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,731

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

-

TANS Electronics

Latvia . 2,681 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,681

-

-

-

-

Problanco Electronics

Mexico . 2,512 parts In-Stock

1+ parts

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100+ parts

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2,512

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-

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Perfect Parts

USA . 827 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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827

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UHIMA Technologies

Türkiye . 662 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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662

-

-

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Microchip USA

USA . 341 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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341

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Overview

Enhance your communication systems with the NB3N206SDG by Onsemi, a top-tier manufacturer known for quality and reliability. As part of the Line Drivers & Receivers category, this product offers seamless integration and enhanced signal transmission capabilities. With a small outline package style and dual terminal position, it provides high-speed data transfer with minimal delay, making it ideal for industrial applications. Trust in Onsemi's expertise and elevate your projects with the NB3N206SDG's superior performance and efficiency. Upgrade your communication systems today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards.

Maximum Supply Voltage: 3.63 V

Supports a wide range of applications with varying supply voltages.

Package Shape: RECTANGULAR

Saves space and allows for efficient placement on PCBs.

Maximum Transmit Delay: 2.4 ns

Ensures fast and reliable data transmission.

Power Supplies (V): 3.3

Commonly used voltage for compatibility with many systems.

No. of Terminals: 8

Provides necessary connections for data transmission.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving and efficient circuit layouts.

Maximum High Level Input Current: 0.00001 Amp

Ensures minimal power consumption.

Minimum Supply Voltage: 2.97 V

Allows for operation in low voltage conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures for reliable performance in various settings.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a durable and corrosion-resistant surface for terminals.

Terminal Position: DUAL

Offering flexibility in connection options.

Maximum Seated Height: 1.75 mm

Low profile design for compact installations.

Width: 3.9 mm

Slim profile for space-efficient circuit board layouts.

Maximum Output Low Current: 8 Amp

Capable of driving high current outputs.

Differential Output: YES

Provides noise immunity and accurate data transmission.

Length: 4.9 mm

Compact size for efficient use of space on PCBs.

Minimum Out Swing: 0.05 V

Ensures accurate output swing levels for reliable signal transmission.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments with varying temperatures.

Maximum Receive Delay: 6 ns

Ensures fast response times for incoming data.

Terminal Form: GULL WING

Provides secure and reliable connections on the PCB.

Interface Standard: EIA-899; TIA-899

Compliant with industry standards for seamless integration into systems.

Maximum Supply Current: 24 mA

Efficient power consumption for energy-saving operation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides noise filtering and accurate signal detection.

Nominal Supply Voltage: 3.3 V

Standard voltage for compatibility with various systems.

Terminal Pitch: 1.27 mm

Provides convenient spacing for terminal connections on the PCB.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for efficient data transmission between systems.

Technical Specifications

Line Drivers & Receivers NB3N206SDG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.05 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

2.4 ns

Width:

3.9 mm

Trade Compliance

NB3N206SDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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