Loading...

NB100LVEP17MNG

Onsemi

NB100LVEP17MNG by Onsemi

NB100LVEP17MNG by Onsemi is a Line Transceiver IC with 4 functions, ECL technology, and differential input characteristics. It operates in industrial temperature range (-40 to 85 °C) with supply voltage of 2.375-5.5 V. Ideal for applications requiring high-speed data transmission over short distances.

Median Price

$11.325

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 54 parts In-Stock

1+ parts

$8.458

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$8.458

-

-

-

Chip1Stop

Japan . 54 parts In-Stock

1+ parts

$8.479

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$8.479

-

-

-

Mouser Electronics

USA . 35 parts In-Stock

1+ parts

$14.860

100+ parts

$11.340

1k+ parts

$10.980

10k+ parts

$10.750

35

$14.860

$11.340

$10.980

$10.750

Rochester

USA . 33,126 parts In-Stock

1+ parts

-

100+ parts

$9.060

1k+ parts

$8.110

10k+ parts

$7.630

33,126

-

$9.060

$8.110

$7.630

DigiKey

USA . 33,126 parts In-Stock

1+ parts

-

100+ parts

$11.930

1k+ parts

-

10k+ parts

-

33,126

-

$11.930

-

-

Farnell

UK . 33,126 parts In-Stock

1+ parts

-

100+ parts

$13.498

1k+ parts

-

10k+ parts

-

33,126

-

$13.498

-

-

Verical

USA . 25,264 parts In-Stock

1+ parts

-

100+ parts

$11.325

1k+ parts

$10.137

10k+ parts

$9.537

25,264

-

$11.325

$10.137

$9.537

Flip Electronics (Authorized)

USA . 3,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,864

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,329 parts In-Stock

1+ parts

$8.055

100+ parts

-

1k+ parts

-

10k+ parts

-

1,329

$8.055

-

-

-

Chip Stock

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35,000

-

-

-

-

Vyrian

USA . 9,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,799

-

-

-

-

Flip Electronics

USA . 3,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,864

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,603 parts In-Stock

1+ parts

$7.631

100+ parts

-

1k+ parts

-

10k+ parts

-

1,603

$7.631

-

-

-

Component Stockers USA

USA . 35,546 parts In-Stock

1+ parts

$8.440

100+ parts

$10.040

1k+ parts

$9.080

10k+ parts

$9.080

35,546

$8.440

$10.040

$9.080

$9.080

Corohmni

South Africa . 225 parts In-Stock

1+ parts

$8.479

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$8.479

-

-

-

Microchip USA

USA . 440 parts In-Stock

1+ parts

$42.620

100+ parts

$42.010

1k+ parts

$41.700

10k+ parts

$41.400

440

$42.620

$42.010

$41.700

$41.400

Continental Prestige Electronics

USA . 33,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,126

-

-

-

-

Kulean Microsystems

USA . 8,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,248

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,302

-

-

-

-

Problanco Electronics

Mexico . 5,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,984

-

-

-

-

TANS Electronics

Latvia . 5,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,872

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

SupplyDigital Components

Austria . 3,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,905

-

-

-

-

UHIMA Technologies

Türkiye . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

330

-

-

-

-

Overview

Enhance your electronic systems with the NB100LVEP17MNG by Onsemi, a top-quality line driver and receiver that delivers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor manufacturing, this product offers cutting-edge technology in a compact chip carrier package. Ideal for industrial applications, the NB100LVEP17MNG provides fast transmission speeds and precise signal reception, ensuring seamless communication in your systems. Upgrade to the Onsemi NB100LVEP17MNG today and experience the difference in quality and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power source options.

No. of Functions: 4

Offers multiple functions in a single component, simplifying circuit design and reducing component count.

Package Shape: RECTANGULAR

Easily fits into standard rectangular PCB layouts, making integration seamless.

Maximum Transmit Delay: 0.325 ns

Enables high-speed communication with minimal delay, crucial for time-sensitive applications.

Power Supplies (V): -4.5

Supports negative power supplies, allowing for versatile power configurations.

No. of Terminals: 24

Provides ample connection points for interfacing with other components or systems.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Compact and thin package style saves space and allows for dense PCB layouts.

Minimum Supply Voltage: 2.375 V

Can operate at low supply voltages, suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, expanding its usability range.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for reliable connections.

Terminal Position: QUAD

Quad terminal position eases PCB layout and component orientation, enhancing ease of assembly.

Maximum Seated Height: 1 mm

Low profile design minimizes the overall height of the component, ideal for space-constrained applications.

Width: 4 mm

Compact width allows for efficient use of PCB real estate, especially in tight layouts.

Receiver No. of Bits: 4

Provides 4 bits of data reception, suitable for applications requiring moderate data processing capabilities.

Differential Output: YES

Differential output helps in noise reduction and signal integrity, crucial for high-speed data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering during assembly, saving time and ensuring proper connections.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering processes without damage.

Length: 4 mm

Compact length contributes to overall space efficiency, beneficial for compact electronic designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring performance in harsh environments.

Maximum Receive Delay: 0.325 ns

Enables fast data reception with minimal delay, crucial for real-time data applications.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation, ideal for high-performance applications.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and enhances reliability of connections.

Maximum Supply Current: 55 mA

Operates at low supply current, minimizing power consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL

Differential input characteristics help in noise rejection and signal integrity, crucial for reliable data transmission.

Nominal Supply Voltage: 2.5 V

Provides a stable nominal supply voltage for consistent performance in various operating conditions.

Nominal Negative Supply Voltage: -4.5 V

Stable negative supply voltage ensures proper operation of the component in dual-supply configurations.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for compact spacing between terminals, ideal for high-density PCB designs.

Driver No. of Bits: 4

Offers 4 bits of data transmission capability, suitable for applications requiring moderate data processing and transfer.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type facilitates bidirectional data transmission between different systems, enhancing connectivity options.

Technical Specifications

Line Drivers & Receivers NB100LVEP17MNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375V TO -5.5V IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.325 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.325 ns

Width:

4 mm

Trade Compliance

NB100LVEP17MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7