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NB100LVEP17MNR2G

Onsemi

NB100LVEP17MNR2G by Onsemi

NB100LVEP17MNR2G by Onsemi is a Line Transceiver with ECL technology. It features 4 functions, differential output, and operates in industrial temperature range. With a max supply voltage of 5.5V, it is suitable for high-speed communication applications requiring precise signal transmission within tight timing constraints.

Median Price

$11.863

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 54,404 parts In-Stock

1+ parts

-

100+ parts

$9.060

1k+ parts

$8.110

10k+ parts

$7.630

54,404

-

$9.060

$8.110

$7.630

DigiKey

USA . 54,404 parts In-Stock

1+ parts

-

100+ parts

$12.490

1k+ parts

-

10k+ parts

-

54,404

-

$12.490

-

-

Verical

USA . 47,972 parts In-Stock

1+ parts

-

100+ parts

$11.863

1k+ parts

$10.613

10k+ parts

$9.988

47,972

-

$11.863

$10.613

$9.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 255 parts In-Stock

1+ parts

$10.042

100+ parts

-

1k+ parts

-

10k+ parts

-

255

$10.042

-

-

-

Vyrian

USA . 155 parts In-Stock

1+ parts

$10.570

100+ parts

-

1k+ parts

-

10k+ parts

-

155

$10.570

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,536 parts In-Stock

1+ parts

$9.513

100+ parts

-

1k+ parts

-

10k+ parts

-

1,536

$9.513

-

-

-

Corohmni

South Africa . 214 parts In-Stock

1+ parts

$10.570

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$10.570

-

-

-

Continental Prestige Electronics

USA . 54,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$14.310

10k+ parts

-

54,432

-

-

$14.310

-

TANS Electronics

Latvia . 8,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,361

-

-

-

-

SupplyDigital Components

Austria . 7,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,746

-

-

-

-

Microchip USA

USA . 3,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,674

-

-

-

-

Problanco Electronics

Mexico . 3,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,057

-

-

-

-

Kulean Microsystems

USA . 2,278 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,278

-

-

-

-

UHIMA Technologies

Türkiye . 244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

244

-

-

-

-

Overview

Enhance your electronic systems with the NB100LVEP17MNR2G by Onsemi. This high-quality line driver and receiver provides reliable performance and precise signal transmission, making it an essential component for a wide range of applications. With its advanced technology and industrial-grade design, this product offers exceptional value, ensuring seamless operation and enhanced efficiency. Trust Onsemi's expertise and elevate your projects with the NB100LVEP17MNR2G today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact installation on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for various applications.

No. of Functions: 4

Offers multiple functions in a single package, reducing the need for multiple components.

Package Shape: RECTANGULAR

Provides stability and ease of mounting on PCBs.

Maximum Transmit Delay: 0.325 ns

Ensures fast and efficient transmission of signals.

Power Supplies (V): -4.5

Supports negative power supplies, allowing for versatile power configurations.

No. of Terminals: 24

Provides ample connectivity options for various inputs and outputs.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Enables compact and low-profile design suitable for space-constrained applications.

Minimum Supply Voltage: 2.375 V

Allows for operation in low voltage conditions.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions.

Terminal Finish: TIN

Provides corrosion resistance and good electrical conductivity.

Terminal Position: QUAD

Provides a stable and secure connection.

Maximum Seated Height: 1 mm

Low profile design for space-saving installations.

Width: 4 mm

Compact form factor for easy integration and space efficiency.

Receiver No. of Bits: 4

Handles 4-bit data signals efficiently.

Differential Output: YES

Provides noise-immune signal transmission for better signal integrity.

Peak Reflow Temperature °C: 260

Withstands high temperatures during the soldering process.

Length: 4 mm

Compact size for space-saving installations.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Maximum Receive Delay: 0.325 ns

Ensures minimal delay in receiving signals.

Technology: ECL

Utilizes ECL (Emitter-Coupled Logic) technology for high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness.

Maximum Supply Current: 55 mA

Low power consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL

Supports differential signaling for improved noise immunity.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

Nominal Negative Supply Voltage: -4.5 V

Stable negative supply voltage for reliable operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts.

Driver No. of Bits: 4

Efficiently drives 4-bit data signals.

Interface IC Type: LINE TRANSCEIVER

Suitable for interfacing between different communication lines.

Technical Specifications

Line Drivers & Receivers NB100LVEP17MNR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375V TO -5.5V IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.325 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.325 ns

Width:

4 mm

Trade Compliance

NB100LVEP17MNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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