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MOC3073TVM

Onsemi

MOC3073TVM by Onsemi

The Onsemi MOC3073TVM is a TRIAC output optocoupler with a max on-state voltage of 2.5V and peak surge current of 1A. It operates in temperatures ranging from -40 to 85 °C, with an isolation voltage of 4170V. Ideal for applications requiring high isolation and reliable triggering in optoelectronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,129 parts In-Stock

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Vyrian

USA . 1,836 parts In-Stock

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Problanco Electronics

Mexico . 5,088 parts In-Stock

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TANS Electronics

Latvia . 4,059 parts In-Stock

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SupplyDigital Components

Austria . 1,990 parts In-Stock

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Corphita

USA . 1,834 parts In-Stock

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Kulean Microsystems

USA . 919 parts In-Stock

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Corohmni

South Africa . 348 parts In-Stock

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UHIMA Technologies

Türkiye . 302 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the MOC3073TVM optocoupler trigger device outputs. This TRIAC output optocoupler offers peak surge current of 1A and maximum isolation voltage of 4170V, making it ideal for a wide range of applications. Trust in Onsemi's reputation for excellence and choose the MOC3073TVM for optimal performance and peace of mind. Unlock new possibilities with this high-quality product that delivers on value, benefits, and advantages for all your electronics needs.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

Low maximum on state voltage ensures efficient performance and minimizes power consumption.

Configuration: SINGLE

SINGLE configuration simplifies installation and makes the product easier to use.

Peak Surge Current: 1 A

High peak surge current capability allows the product to handle sudden spikes in current without damage.

Maximum Forward Current: 0.06 A

The high maximum forward current rating allows the product to handle higher current loads efficiently.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler ensures precise control and compatibility with triac-based systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the product suitable for various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate even in cold environments.

Maximum Input Trigger Current: 0.006 A

Low input trigger current ensures efficient triggering and compatibility with various control circuits.

Repetitive Off-state Voltage (Peak): 800 V

High repetitive off-state voltage rating ensures reliable performance and protection against voltage spikes.

Packing Method: TUBE

Tube packing method provides easy and secure storage and transportation of the product.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power losses and ensures efficient operation.

Maximum Isolation Voltage: 4170 V

High isolation voltage rating provides safety and protection against high voltage risks.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature allows easy and secure installation on PCBs or other surfaces.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3073TVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.006 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3073TVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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