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MOC3053SR2M

Onsemi

MOC3053SR2M by Onsemi

MOC3053SR2M by Onsemi is a TRIAC output optocoupler with max on-state voltage of 2.5V and peak surge current of 1A. It operates b/w -40 to 85 °C, has isolation voltage of 4170V, and is ideal for triggering devices in applications requiring high voltage protection.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 1,000 parts In-Stock

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$0.330

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Vyrian

USA . 4,159 parts In-Stock

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Digiode

USA . 1,363 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 96 parts In-Stock

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$19.780

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Problanco Electronics

Mexico . 5,851 parts In-Stock

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SupplyDigital Components

Austria . 3,218 parts In-Stock

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Kulean Microsystems

USA . 2,063 parts In-Stock

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TANS Electronics

Latvia . 1,080 parts In-Stock

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Corohmni

South Africa . 410 parts In-Stock

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Corphita

USA . 261 parts In-Stock

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UHIMA Technologies

Türkiye . 72 parts In-Stock

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Overview

Experience seamless and reliable performance with the MOC3053SR2M from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality optocoupler trigger devices that offer unmatched precision and durability. This product is ideal for a wide range of applications, providing customers with superior functionality and peace of mind. Trust Onsemi to provide you with the value, benefits, and advantages you deserve in your electronic components. Elevate your projects with the MOC3053SR2M and experience the difference today.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

Low on-state voltage helps in reducing power consumption and heat generation, making it more energy-efficient.

Configuration: SINGLE

SINGLE configuration simplifies the setup and integration of the optocoupler trigger device.

Peak Surge Current: 1 A

High peak surge current capability provides robust protection against transient voltage spikes.

Maximum Forward Current: 0.06 A

Capability to handle high forward current ensures reliable performance in demanding applications.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler offers bidirectional switching capabilities, making it versatile for various circuit designs.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the optocoupler trigger device to function effectively in different environmental conditions.

Minimum Operating Temperature: -40 °C

Suitable for operation in cold environments without compromising performance.

Maximum Input Trigger Current: 0.006 A

The low trigger current requirement ensures efficient control and activation of the optocoupler.

Repetitive Off-state Voltage (Peak): 600 V

High off-state voltage rating provides reliable insulation and isolation for safe operation in high-voltage applications.

Packing Method: TR

TR packaging method offers convenient handling and storage of the optocoupler trigger device.

Maximum Reverse Leakage Current: 0.0001 A

Minimal reverse leakage current ensures high reliability and stable performance over time.

Minimum Peak Off-state Voltage: 600 V

High off-state voltage rating supports reliable switching and isolation in demanding environments.

Maximum Isolation Voltage: 4170 V

High isolation voltage rating ensures safe operation and protection against voltage spikes in critical applications.

Mounting Feature: SURFACE MOUNT

Surface mount design enables easy and secure installation on PCBs, saving space and simplifying manufacturing processes.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3053SR2M attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.006 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Minimum Peak Off-state Voltage:

600 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3053SR2M Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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