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MOC3051SVM

Onsemi

MOC3051SVM by Onsemi

The Onsemi MOC3051SVM is a single TRIAC output optocoupler with a max on-state voltage of 2.5V and peak surge current of 1A. It operates b/w -40 to 85°C, has an isolation voltage of 4170V, and is ideal for triggering devices in applications requiring high voltage protection.

Median Price

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4

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1k+

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Digiode

USA . 2,109 parts In-Stock

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Lantek

USA . 900 parts In-Stock

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900

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Vyrian

USA . 850 parts In-Stock

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850

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Andel Nordic

Denmark . 597 parts In-Stock

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$1.307

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AZTECH Wire

Italy . 356 parts In-Stock

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$16.939

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Ampacity Inc.

Singapore . 875 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Continental Prestige Electronics

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TANS Electronics

Latvia . 3,644 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 2,020 parts In-Stock

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Glotronic Ltd.

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Supply Digital

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GreenTree Electronics

Israel . 900 parts In-Stock

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UHIMA Technologies

Türkiye . 734 parts In-Stock

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Corohmni

South Africa . 434 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Argo Parts USA

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Overview

Unlock the potential of your electronic designs with the MOC3051SVM by Onsemi. Known for its superior quality and reliability, Onsemi is a trusted manufacturer in the industry. The MOC3051SVM falls under the category of Optocoupler Trigger Device Outputs, offering peak surge current of 1 A and maximum isolation voltage of 4170 V. Ideal for various applications, this product provides value through its high performance and precision. Experience the benefits and advantages that this optocoupler trigger device output brings to your projects.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

Low voltage drop ensures efficient operation and minimal power loss.

Configuration: SINGLE

Simplified design and ease of use in a single configuration.

Peak Surge Current: 1 A

Capable of handling high surge currents effectively.

Maximum Forward Current: 0.06 A

Efficient output current handling for various applications.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler offers versatility and compatibility with different systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for reliable performance in varying conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in cold environments without issues.

Maximum Input Trigger Current: 0.015 A

Low trigger current requirement for efficient operation.

Repetitive Off-state Voltage (Peak): 600 V

High off-state voltage rating for enhanced safety and reliability.

Packing Method: TUBE

Convenient packaging for easy handling and storage.

Maximum Reverse Leakage Current: 0.0001 A

Minimal leakage current to prevent energy wastage.

Minimum Peak Off-state Voltage: 600 V

High off-state voltage ensures proper isolation in circuits.

Maximum Isolation Voltage: 4170 V

High isolation rating for enhanced safety in sensitive applications.

Mounting Feature: SURFACE MOUNT

Surface mount capability for easy and secure installation.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3051SVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

600 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3051SVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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