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MOC3010TVM

Onsemi

MOC3010TVM by Onsemi

MOC3010TVM by Onsemi is a TRIAC output optocoupler with max on-state voltage of 3V and peak surge current of 1A. It operates b/w -40 to 85 °C, with isolation voltage up to 4170V. Ideal for triggering devices in applications requiring high voltage protection and signal isolation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,729 parts In-Stock

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Vyrian

USA . 2,367 parts In-Stock

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Andel Nordic

Denmark . 110 parts In-Stock

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$1.105

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QUARKTWIN TECHNOLOGY LTD

USA . 27,312 parts In-Stock

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Problanco Electronics

Mexico . 7,613 parts In-Stock

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TANS Electronics

Latvia . 5,129 parts In-Stock

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SupplyDigital Components

Austria . 3,656 parts In-Stock

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Kulean Microsystems

USA . 3,111 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 484 parts In-Stock

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Supply Digital

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Corohmni

South Africa . 196 parts In-Stock

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Overview

Enhance your electronic projects with the MOC3010TVM Optocoupler Trigger Device Outputs by Onsemi. Known for its top-notch quality and reliability, Onsemi brings you a product that offers peak surge current of 1A, maximum on-state voltage of 3V, and maximum isolation voltage of 4170V. Whether you're working on lighting controls, motor controls, or power supplies, this TRIAC output optocoupler provides the perfect solution. Experience seamless integration and enhanced performance with the MOC3010TVM – your go-to choice for superior optoelectronic components.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low maximum on state voltage ensures efficient and reliable performance.

Configuration: SINGLE

Single configuration simplifies installation and usage.

Peak Surge Current: 1 A

High peak surge current allows handling of sudden power surges effectively.

Maximum Forward Current: 0.06 A

Low maximum forward current helps in reducing power consumption.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler type allows for precise switching and control.

Maximum Operating Temperature: 85 °C

Wide maximum operating temperature range ensures product reliability in various environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in cold environments.

Maximum Input Trigger Current: 0.015 A

Low maximum input trigger current ensures efficient triggering of the device.

Repetitive Off-state Voltage (Peak): 250 V

High repetitive off-state voltage allows for safe operation in high voltage situations.

Packing Method: TUBE

Tube packing method provides convenient storage and handling of the product.

Maximum Reverse Leakage Current: 0.0001 A

Low maximum reverse leakage current ensures minimal loss of power.

Minimum Peak Off-state Voltage: 250 V

High minimum peak off-state voltage ensures reliable performance in off-state conditions.

Maximum Isolation Voltage: 4170 V

High maximum isolation voltage ensures safety and protection from high voltages.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable installation of the product.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3010TVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

250 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3010TVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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