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MM5Z3V6ST1G

Onsemi

MM5Z3V6ST1G by Onsemi

MM5Z3V6ST1G by Onsemi is a Zener diode with a 3.6V nominal reference voltage and 5mA working test current. It has a max reverse current of 5uA, making it suitable for applications requiring precise voltage regulation in electronic circuits. With a small outline package style and dual terminals, this diode operates b/w -65 to 150 °C and offers a max power dissipation of 0.2W.

Median Price

$0.030

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 100 parts In-Stock

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-

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$0.030

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$0.025

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$0.023

100

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$0.030

$0.025

$0.023

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$0.019

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Digiode

USA . 1,706 parts In-Stock

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$0.024

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Vyrian

USA . 1,921 parts In-Stock

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Corohmni

South Africa . 429 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Ampacity Inc.

Singapore . 100 parts In-Stock

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Corphita

USA . 2,478 parts In-Stock

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AZTECH Wire

Italy . 388 parts In-Stock

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$10.243

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QUARKTWIN TECHNOLOGY LTD

USA . 27,990 parts In-Stock

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TANS Electronics

Latvia . 7,347 parts In-Stock

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Kulean Microsystems

USA . 5,471 parts In-Stock

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Problanco Electronics

Mexico . 2,796 parts In-Stock

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SupplyDigital Components

Austria . 1,158 parts In-Stock

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

Türkiye . 446 parts In-Stock

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Overview

Unlock a world of possibilities with the MM5Z3V6ST1G Zener Diode by Onsemi. Manufactured by a trusted industry leader, this diode offers unparalleled quality and reliability. With applications ranging from voltage regulation to signal conditioning, this small yet powerful component provides essential protection for your electronic circuits. Experience the value of precise voltage control, increased efficiency, and enhanced performance with the MM5Z3V6ST1G. Trust Onsemi to deliver cutting-edge technology that empowers your projects to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diode, ensuring a longer lifespan.

Working Test Current: 5 mA

Suitable for various low-power applications, ensuring efficient performance.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort.

Maximum Reverse Current: 5 uA

Ensures reliable performance by minimizing leakage current.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for diverse operating environments.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance to maintain optimal performance.

Diode Type: ZENER DIODE

Specifically designed for voltage regulation applications, ensuring precise and stable output.

Technical Specifications

Zener Diodes MM5Z3V6ST1G attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

1000 ohm

Maximum Forward Voltage (VF):

.9 V

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Maximum Knee Impedance:

90 ohm

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.2 W

Qualification:

Not Qualified

Nominal Reference Voltage:

3.6 V

Maximum Reverse Current:

5 uA

Reverse Test Voltage:

1 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

3.36 %

Working Test Current:

5 mA

Trade Compliance

MM5Z3V6ST1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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