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MKP9V160RL

Onsemi

MKP9V160RL by Onsemi

MKP9V160RL by Onsemi is a DIAC with breakdown voltage of 150-170 V, in single configuration. It has round package shape with wire terminals. Ideal for triggering devices in AC circuits, it offers isolated case connection and peak reflow temperature of 260°C.

Median Price

$0.171

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 65,000 parts In-Stock

1+ parts

-

100+ parts

$0.185

1k+ parts

$0.153

10k+ parts

$0.137

65,000

-

$0.185

$0.153

$0.137

Farnell

UK . 65,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.129

65,000

-

-

-

$0.129

Verical

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.171

35,000

-

-

-

$0.171

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.135

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.135

-

-

-

Digiode

USA . 890 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

-

10k+ parts

-

890

$0.144

-

-

-

Vyrian

USA . 64,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

64,662

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 64,849 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

-

10k+ parts

-

64,849

$0.110

-

-

-

Corohmni

South Africa . 348 parts In-Stock

1+ parts

$0.129

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$0.129

-

-

-

Bastille Electronics

Australia . 3,072 parts In-Stock

1+ parts

$0.135

100+ parts

$0.128

1k+ parts

$0.122

10k+ parts

$0.120

3,072

$0.135

$0.128

$0.122

$0.120

Corphita

USA . 470 parts In-Stock

1+ parts

$0.137

100+ parts

-

1k+ parts

-

10k+ parts

-

470

$0.137

-

-

-

Component Stockers USA

USA . 50,302 parts In-Stock

1+ parts

$0.150

100+ parts

$0.140

1k+ parts

$0.130

10k+ parts

$0.130

50,302

$0.150

$0.140

$0.130

$0.130

SupplyDigital Components

Austria . 6,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,827

-

-

-

-

Kulean Microsystems

USA . 5,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,942

-

-

-

-

TANS Electronics

Latvia . 2,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,984

-

-

-

-

Problanco Electronics

Mexico . 1,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,590

-

-

-

-

UHIMA Technologies

Türkiye . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Overview

Unlock the power of precision with the MKP9V160RL by Onsemi. Crafted by a trusted manufacturer known for quality and reliability, this DIAC diode offers unparalleled performance in a variety of applications. Whether you're looking to enhance the efficiency of your electronic circuits or improve the accuracy of your voltage regulation, this product delivers unmatched value and benefits. Trust Onsemi to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Configuration: SINGLE

The single configuration allows for easy installation and maintenance, making it a convenient choice for electrical circuits.

Minimum Breakdown Voltage: 150 V

With a minimum breakdown voltage of 150 V, this DIAC is suitable for handling high voltage applications with ease.

Package Shape: ROUND

The round package shape enhances durability and reliability, making this DIAC ideal for long-term use in various electronic devices.

Terminal Form: WIRE

The wire terminal form ensures secure connections, reducing the risk of disconnections and improving overall performance.

No. of Terminals: 2

With 2 terminals, this DIAC is simple to install and connect within a circuit, making it a user-friendly choice for engineers and technicians.

Package Style (Meter): LONG FORM

The long form package style provides ample space for labeling and organization, allowing for easy identification during installation and maintenance.

Trigger Device Type: DIAC

Being a DIAC trigger device type, this product ensures precise and controlled triggering in alternating current circuits, enhancing efficiency and safety.

Terminal Finish: Tin (Sn)

The tin terminal finish offers excellent conductivity and corrosion resistance, contributing to the overall reliability and longevity of this DIAC.

Terminal Position: AXIAL

The axial terminal position enables simple and secure mounting, ensuring stability and performance in various electronic applications.

Case Connection: ISOLATED

The isolated case connection enhances safety by preventing electrical interference, making this DIAC a dependable choice for sensitive circuits.

Maximum Breakdown Voltage: 170 V

With a maximum breakdown voltage of 170 V, this DIAC can withstand voltage fluctuations and surges, providing reliable protection in demanding environments.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures optimal soldering and reflow processes, improving overall product quality and performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C guarantees efficient and precise soldering, maintaining the integrity and functionality of this DIAC during manufacturing processes.

Technical Specifications

Diode For Alternating Current (DIAC) MKP9V160RL attributes and parameters. Explore more Diode For Alternating Current (DIAC) devices from Onsemi

Specs

Maximum Breakdown Voltage:

170 V

Minimum Breakdown Voltage:

150 V

Case Connection:

Configuration:

JEDEC-95 Code:

DO-41

JESD-30 Code:

O-XALF-W2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

UNSPECIFIED

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

WIRE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Device Type:

Trade Compliance

MKP9V160RL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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