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DB3G1V

STMicroelectronics

DB3G1V by STMicroelectronics

DB3G1V by STMicroelectronics is a single DIAC designed for AC applications, featuring a breakdown voltage range of 30-34 V. It operates in temperatures from -40 °C to 125 °C and comes in a long-form, round plastic/epoxy package with axial terminals. Ideal for triggering circuits, it ensures reliable performance in various electronic devices.

Median Price

$0.063

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 26,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.063

26,000

-

-

-

$0.063

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 26,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.088

26,000

-

-

-

$0.088

Vyrian

USA . 5,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,442

-

-

-

-

Anansix

USA . 2,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,887

-

-

-

-

Digiode

USA . 644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 679 parts In-Stock

1+ parts

$0.133

100+ parts

-

1k+ parts

-

10k+ parts

$0.127

679

$0.133

-

-

$0.127

Northwest PG Solutions

USA . 719 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

$0.129

719

$0.146

-

-

$0.129

IDEA Electronic Components Group

UK . 1,549 parts In-Stock

1+ parts

$4.044

100+ parts

-

1k+ parts

$3.640

10k+ parts

-

1,549

$4.044

-

$3.640

-

MKK Technologies

India . 2,160 parts In-Stock

1+ parts

$7.605

100+ parts

-

1k+ parts

-

10k+ parts

-

2,160

$7.605

-

-

-

DigiPath Technology Company

USA . 2,160 parts In-Stock

1+ parts

$7.605

100+ parts

-

1k+ parts

-

10k+ parts

-

2,160

$7.605

-

-

-

Corphita

USA . 2,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,838

-

-

-

-

Parana Technologies

USA . 2,207 parts In-Stock

1+ parts

-

100+ parts

$4.836

1k+ parts

-

10k+ parts

-

2,207

-

$4.836

-

-

Overview

Elevate your designs with the DB3G1V by STMicroelectronics—a trusted name in innovation and quality. This versatile DIAC is engineered for optimal performance in AC applications, delivering consistent reliability from -40 °C to 125 °C. With its robust plastic/epoxy package and user-friendly design, it simplifies integration while ensuring safety and durability. Choose DB3G1V for exceptional value that empowers your projects with superior efficiency and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making this DIAC suitable for a variety of applications.

Configuration: SINGLE

A single configuration simplifies circuit design and space requirements, making the integration easier in various electronic devices.

Minimum Breakdown Voltage: 30 V

This minimum threshold ensures reliable operation in various applications, providing a level of safety for sensitive components.

Package Shape: ROUND

The round shape allows for efficient thermal management and space optimization on circuit boards.

Terminal Form: WIRE

Wire terminals facilitate easy connections in through-hole designs, enhancing assembly efficiency in manufacturing processes.

No. of Terminals: 2

With only two terminals, this DIAC simplifies circuit topology and reduces the chance of wiring errors.

Package Style (Meter): LONG FORM

The long form design can accommodate longer lead lengths, which is beneficial for specific mounting and space-saving layouts.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows this product to perform effectively in extreme conditions, enhancing reliability in demanding applications.

Trigger Device Type: DIAC

As a DIAC, it is particularly useful in triggering and switching applications, making it ideal for various control circuits.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this DIAC can be used in cold environments, expanding its range of applications.

Terminal Position: AXIAL

Axial terminal position enhances flexibility in mounting options, supporting various PCB layout designs.

Case Connection: ISOLATED

Isolated case connections prevent unwanted interactions with other circuit components, enhancing overall circuit reliability.

Maximum Breakdown Voltage: 34 V

A maximum breakdown voltage of 34 V offers a safety margin above the minimum, ensuring that the device operates reliably under varying conditions.

Technical Specifications

Diode For Alternating Current (DIAC) DB3G1V attributes and parameters. Explore more Diode For Alternating Current (DIAC) devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

34 V

Minimum Breakdown Voltage:

30 V

Case Connection:

Configuration:

JEDEC-95 Code:

DO-35

JESD-30 Code:

O-PALF-W2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

Trigger Device Type:

Trade Compliance

DB3G1V Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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