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MC78L08ABDG

Onsemi

MC78L08ABDG by Onsemi

MC78L08ABDG by Onsemi is a fixed positive single output standard regulator with an output voltage of 8V and max current of 0.1A. Operating temperature ranges from -40 to 125 °C, making it suitable for various electronic applications requiring stable voltage regulation in compact designs.

Median Price

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Lifecycle Status

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Chip Stock

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Digiode

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PC Components Company LLC

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Bristol Electronics

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DF Sales Co.

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Prism Electronics

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LIBRA Elektronik GmbH

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J2 Sourcing AB

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AZTECH Wire

Italy . 979 parts In-Stock

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UHIMA Technologies

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TANS Electronics

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SupplyDigital Components

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Microchip USA

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Overview

Experience the ultimate in power regulation with the MC78L08ABDG by Onsemi. With a legacy of excellence, Onsemi delivers top-notch quality and reliability in every product. This fixed positive single output standard regulator is perfect for a wide range of applications, providing a stable 8V output with minimal voltage tolerance. Say goodbye to fluctuating power sources and hello to consistent performance. Trust Onsemi to provide you with the best in power regulation technology, ensuring your devices run smoothly and efficiently at all times.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product.

Surface Mount: YES

Facilitates easy installation and space-saving on circuit boards.

Operating Temperature (TJ-Max): 125 °C

Ensures stable performance even at high temperatures.

Technology: BIPOLAR

Offers efficient voltage regulation and accuracy.

Nominal Output Voltage-1: 8 V

Provides a reliable and stable output voltage for connected devices.

Maximum Output Current-1: 0.1 A

Can provide enough current for many low-power applications.

Maximum Input Voltage: 23 V

Wide input voltage range allows for versatile applications.

Technical Specifications

Fixed Regulators - Positive Single Output Standard MC78L08ABDG attributes and parameters. Explore more Fixed Regulators - Positive Single Output Standard devices from Onsemi

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1.7 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

23 V

Minimum Input Voltage:

10.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Maximum Line Regulation:

.175 %

Maximum Load Regulation:

.08 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

8.3 V

Minimum Output Voltage-1:

7.7 V

Nominal Output Voltage-1:

8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

4 %

Width:

3.9 mm

Trade Compliance

MC78L08ABDG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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