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MC74LVXT4066M

Onsemi

MC74LVXT4066M by Onsemi

MC74LVXT4066M by Onsemi is a 4-function SPST switch with 50 ohm Ron, 25 ns switch-on time, and 35 ns switch-off time. It operates at -55 to 125 °C, suitable for military-grade applications requiring separate output control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,980 parts In-Stock

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5,980

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Digiode

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 1,157 parts In-Stock

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$9.530

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1,157

$9.530

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Kulean Microsystems

USA . 8,395 parts In-Stock

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SupplyDigital Components

Austria . 7,975 parts In-Stock

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Corphita

USA . 2,246 parts In-Stock

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TANS Electronics

Latvia . 598 parts In-Stock

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598

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Problanco Electronics

Mexico . 349 parts In-Stock

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349

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Corohmni

South Africa . 285 parts In-Stock

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Microchip USA

USA . 147 parts In-Stock

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UHIMA Technologies

Türkiye . 76 parts In-Stock

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Overview

Upgrade your electronic designs with the MC74LVXT4066M by Onsemi. As a leader in the industry, Onsemi delivers top-quality multiplexers & switches that are versatile and reliable. This product offers customers seamless switching capabilities and enhanced performance, making it ideal for a wide range of applications. With its compact design and superior functionality, the MC74LVXT4066M provides exceptional value and unmatched benefits to meet your electronic needs. Experience innovation at its finest with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 4

Having 4 functions in one device increases versatility and functionality in a single package.

Nominal Supply Voltage (Vsup): 3 V

Operates efficiently at a supply voltage of 3V, making it compatible with many power sources.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, ensuring reliability in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Multiplexers & Switches MC74LVXT4066M attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

CONFIGURABLE AS 4-CHANNEL SINGLE ENDED MUX/DEMUX

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

37 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

35 ns

Maximum Switch-on Time:

25 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.275 mm

Trade Compliance

MC74LVXT4066M Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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