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MC74LVXT4053MEL

Onsemi

MC74LVXT4053MEL by Onsemi

MC74LVXT4053MEL by Onsemi is a 3-function CMOS multiplexer with 16 terminals. It operates at a supply voltage of 3.3V and offers a max on-state resistance of 26 ohm. Ideal for military-grade applications requiring fast switching times and high isolation levels.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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AZTECH Wire

Italy . 600 parts In-Stock

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Component Stockers USA

USA . 727 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,209 parts In-Stock

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Microchip USA

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Problanco Electronics

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SupplyDigital Components

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TANS Electronics

Latvia . 3,371 parts In-Stock

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UHIMA Technologies

Türkiye . 498 parts In-Stock

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Corohmni

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Kulean Microsystems

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Overview

Upgrade your electronic systems with the MC74LVXT4053MEL from Onsemi, a trusted manufacturer in the industry. This multiplexer & switch boasts top-notch quality and reliability, providing seamless functionality for various applications. With its durable plastic/epoxy package body material and small outline design, this product offers exceptional performance at a nominal supply voltage of 3V. Experience swift switching times, low on-state resistance, and superior isolation with the MC74LVXT4053MEL, making it the go-to choice for your next project. Elevate your circuits with this cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and flexibility in the packaging of the multiplexer, making it suitable for various applications.

Number of Functions: 3

Having 3 functions in one device allows for more versatility and functionality in the system where this multiplexer is implemented.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this multiplexer can withstand elevated temperatures and harsh operating environments.

Technology: CMOS

The CMOS technology used in this multiplexer ensures low power consumption and high noise immunity, enhancing the overall performance of the device.

Technical Specifications

Multiplexers & Switches MC74LVXT4053MEL attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

Maximum Negative Supply Voltage (Vsup):

-3 V

Minimum Negative Supply Voltage (Vsup):

-1.25 V

Nominal Negative Supply Voltage (Vsup):

-3 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

70 dB

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

26 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.25 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

28 ns

Maximum Switch-on Time:

28 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.275 mm

Trade Compliance

MC74LVXT4053MEL Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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