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MC74LVX4053DT

Onsemi

MC74LVX4053DT by Onsemi

MC74LVX4053DT by Onsemi is a CMOS multiplexer with 3 functions, operating at -55 to 125 °C. It has a max on-state resistance of 26 ohm and switching voltage of 6 V. Ideal for military-grade applications requiring high isolation and fast switching times.

Median Price

$0.166

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,773 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

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$0.127

4,773

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$0.172

$0.143

$0.127

Verical

USA . 3,089 parts In-Stock

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$0.159

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$0.159

Distributors (In-Stock)

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Digiode

USA . 2,310 parts In-Stock

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$0.134

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2,310

$0.134

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Vyrian

USA . 4,400 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,831 parts In-Stock

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$0.127

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$0.127

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Corohmni

South Africa . 435 parts In-Stock

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$0.141

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435

$0.141

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AZTECH Wire

Italy . 982 parts In-Stock

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$15.660

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982

$15.660

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SupplyDigital Components

Austria . 8,071 parts In-Stock

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Kulean Microsystems

USA . 7,287 parts In-Stock

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Continental Prestige Electronics

USA . 4,773 parts In-Stock

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$0.123

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4,773

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TANS Electronics

Latvia . 3,100 parts In-Stock

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Problanco Electronics

Mexico . 1,964 parts In-Stock

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UHIMA Technologies

Türkiye . 671 parts In-Stock

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Microchip USA

USA . 340 parts In-Stock

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Overview

Unlock the power of precision with the MC74LVX4053DT by Onsemi. Crafted with top-quality materials and cutting-edge technology, this versatile multiplexer offers seamless switching between functions with minimal signal distortion. Perfect for a wide range of applications, from industrial automation to consumer electronics, this compact device delivers unparalleled performance and reliability. Experience the difference with Onsemi's MC74LVX4053DT - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 3

Offers multiple functions in a single component, providing versatility and functionality in circuit design.

Nominal Supply Voltage (Vsup): 3 V

Operates at a common voltage level, making it compatible with various power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in demanding industrial environments.

No. of Channels: 2

Provides multiple channels for routing signals, increasing the flexibility and options for signal paths.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Multiplexers & Switches MC74LVX4053DT attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Minimum Negative Supply Voltage (Vsup):

-6 V

Nominal Negative Supply Voltage (Vsup):

-3 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

70 dB

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

26 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3/GND,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

28 ns

Maximum Switch-on Time:

28 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

MC74LVX4053DT Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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