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MC74LVX4051DTG

Onsemi

MC74LVX4051DTG by Onsemi

MC74LVX4051DTG by Onsemi is a CMOS single-ended multiplexer with 8 channels. It operates at temperatures from -55 to 125 °C and has a max supply voltage of 6V. With a nominal off-state isolation of 70 dB, it is ideal for military-grade applications requiring low on-state resistance and high signal current capabilities.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 552 parts In-Stock

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$0.740

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$0.419

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$0.369

10k+ parts

$0.334

552

$0.740

$0.419

$0.369

$0.334

Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$0.740

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$0.396

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$0.346

10k+ parts

$0.312

63

$0.740

$0.396

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$0.312

Flip Electronics (Authorized)

USA . 8,352 parts In-Stock

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Digiode

USA . 110 parts In-Stock

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$0.618

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$0.618

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TME

Poland . 119 parts In-Stock

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$0.910

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Vyrian

USA . 8,372 parts In-Stock

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NAC Semi

USA . 1,536 parts In-Stock

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$0.626

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$0.579

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Distributors (Availability)

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Corphita

USA . 1,130 parts In-Stock

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$0.585

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$0.585

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Corohmni

South Africa . 272 parts In-Stock

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$0.626

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$23.265

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$21.171

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$19.077

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$19.077

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Problanco Electronics

Mexico . 8,065 parts In-Stock

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SupplyDigital Components

Austria . 6,352 parts In-Stock

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TANS Electronics

Latvia . 5,127 parts In-Stock

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Eastek

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GreenTree Electronics

Israel . 1,920 parts In-Stock

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Kulean Microsystems

USA . 1,352 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 147 parts In-Stock

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Overview

Enhance your electronic designs with the MC74LVX4051DTG by Onsemi. Crafted with precision and expertise, this multiplexer offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides seamless switching capabilities with minimal power consumption, ensuring optimal performance. Experience the value of efficiency and durability with this versatile component from a trusted manufacturer. Choose the MC74LVX4051DTG for superior results in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort.

Nominal Supply Voltage (Vsup): 3 V

Ideal voltage for stable performance and reliability.

No. of Terminals: 16

Provides ample connectivity options for various applications.

Maximum Operating Temperature: 125 °C

Ensures the product can operate efficiently in high-temperature environments.

Minimum Operating Temperature: -55 °C

Ensures the product can operate in low-temperature environments without issues.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Maximum Signal Current: 0.02 A

Can handle a decent amount of current for transmitting signals effectively.

Technical Specifications

Multiplexers & Switches MC74LVX4051DTG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 2.5V TO 6V SINGLE SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-3 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

70 dB

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

37 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

28 ns

Maximum Switch-on Time:

28 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

MC74LVX4051DTG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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