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MC74HC74AFG

Onsemi

MC74HC74AFG by Onsemi

MC74HC74AFG by Onsemi is a dual-function latch with 14 terminals, operating at 3V. It has a propagation delay of 150ns and can handle load capacitance of 50pF. Ideal for applications requiring positive edge triggering, with a max frequency of 20MHz in military-grade environments.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

4,000

-

$0.343

$0.285

$0.254

Verical

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.386

10k+ parts

$0.356

2,200

-

-

$0.386

$0.356

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,336 parts In-Stock

1+ parts

$0.268

100+ parts

-

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-

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2,336

$0.268

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Vyrian

USA . 4,971 parts In-Stock

1+ parts

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4,971

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,305 parts In-Stock

1+ parts

$0.254

100+ parts

-

1k+ parts

-

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1,305

$0.254

-

-

-

Corohmni

South Africa . 221 parts In-Stock

1+ parts

$0.269

100+ parts

-

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-

221

$0.269

-

-

-

Component Stockers USA

USA . 5,171 parts In-Stock

1+ parts

$0.290

100+ parts

$0.270

1k+ parts

$0.250

10k+ parts

-

5,171

$0.290

$0.270

$0.250

-

AZTECH Wire

Italy . 1,173 parts In-Stock

1+ parts

$22.200

100+ parts

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1,173

$22.200

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TANS Electronics

Latvia . 6,272 parts In-Stock

1+ parts

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6,272

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Problanco Electronics

Mexico . 5,803 parts In-Stock

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5,803

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SupplyDigital Components

Austria . 4,739 parts In-Stock

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4,739

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.239

10k+ parts

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4,000

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-

$0.239

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Kulean Microsystems

USA . 1,605 parts In-Stock

1+ parts

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1,605

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UHIMA Technologies

Türkiye . 749 parts In-Stock

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749

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Assy Fe

Spain . 408 parts In-Stock

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408

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Microchip USA

USA . 312 parts In-Stock

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312

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Overview

Upgrade your electronic projects with the MC74HC74AFG by Onsemi, a top-quality latches & flip-flops component that offers reliability and precision. Onsemi's reputation for excellence ensures that this product meets the highest industry standards, providing customers with peace of mind. Ideal for a wide range of applications, this versatile component delivers value, efficiency, and performance. Trust Onsemi to deliver cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the latch or flip-flop.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards for compact design.

No. of Functions: 2

Having 2 functions in one component can save space and simplify circuit designs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V allows for compatibility with various systems.

Propagation Delay (tpd): 150 ns

Fast propagation delay ensures quick response times in circuit operations.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes this latch or flip-flop suitable for harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Latches & Flip-Flops MC74HC74AFG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC74AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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