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MC74HC595AN

Onsemi

MC74HC595AN by Onsemi

MC74HC595AN by Onsemi is an 8-bit digital shift register with a propagation delay of 210 ns. It operates at a supply voltage range of 2-6V and has a max frequency of 20MHz. Ideal for applications requiring true output polarity, such as military-grade temperature-sensitive devices.

Median Price

$0.218

Lifecycle Status

Suppliers In-Stock

54

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1k+

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EXC GmbH

Germany . 191 parts In-Stock

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Nova Conductors

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TEDSS.com

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Forefront Electronics and Design

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Semi Source

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Corohmni

South Africa . 348 parts In-Stock

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Continental Prestige Electronics

USA . 2,335 parts In-Stock

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Argo Parts USA

USA . 936 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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AZTECH Wire

Italy . 614 parts In-Stock

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Ampacity Inc.

Singapore . 1,552 parts In-Stock

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Lixinc

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Problanco Electronics

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Overview

Unlock endless possibilities with the MC74HC595AN by Onsemi, a high-quality digital shift register that revolutionizes the way you control and manipulate data. Manufactured by the industry leader Onsemi, this product offers unparalleled reliability and precision. Ideal for a wide range of applications, this versatile shift register provides customers with unmatched value, benefits, and advantages. Say goodbye to limitations and hello to limitless opportunities with the MC74HC595AN.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and cost-effective, making the product a good choice for various applications.

Package Shape:

RECTANGULAR - This shape allows for easy integration into circuit boards, making the product convenient to use.

No. of Bits:

8 - With 8 bits, this product is suitable for handling moderate amounts of data in digital circuits.

Nominal Supply Voltage / Vsup (V):

3 - The nominal supply voltage of 3V ensures compatibility with a wide range of systems, making the product versatile.

Power Supplies (V):

2/6 - With multiple power supply options, this product can be used in different settings and configurations.

No. of Terminals:

16 - The 16 terminals provide ample connectivity options, making the product flexible for various setups.

Package Style (Meter):

IN-LINE - The in-line package style saves space and simplifies installation, making the product efficient in circuit design.

Propagation Delay (tpd):

210 ns - The low propagation delay helps in reducing signal latency, making the product suitable for high-speed applications.

Maximum Operating Temperature:

125 °C - With a high maximum operating temperature, this product is reliable in harsh environments.

Output Characteristics:

3-STATE - The 3-state output allows for flexibility in controlling the output signals, making the product versatile in digital systems.

Technical Specifications

Digital Shift Registers MC74HC595AN attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2/6

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC595AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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