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MC74HC595AFELG

Onsemi

MC74HC595AFELG by Onsemi

SERIAL IN PARALLEL OUT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.379

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,399 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

3,399

-

$0.357

$0.296

$0.264

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.330

2,000

-

-

$0.401

$0.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 586 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$0.277

-

-

-

Vyrian

USA . 8,059 parts In-Stock

1+ parts

-

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-

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8,059

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

1+ parts

-

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-

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2,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,643 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

-

2,643

$0.234

-

-

-

Corphita

USA . 2,171 parts In-Stock

1+ parts

$0.263

100+ parts

-

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-

10k+ parts

-

2,171

$0.263

-

-

-

Corohmni

South Africa . 493 parts In-Stock

1+ parts

$0.275

100+ parts

-

1k+ parts

-

10k+ parts

-

493

$0.275

-

-

-

AZTECH Wire

Italy . 1,157 parts In-Stock

1+ parts

$16.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,157

$16.630

-

-

-

A-Z Elektronik GmbH

Germany . 7,398 parts In-Stock

1+ parts

-

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-

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7,398

-

-

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Kulean Microsystems

USA . 7,394 parts In-Stock

1+ parts

-

100+ parts

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7,394

-

-

-

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Problanco Electronics

Mexico . 4,298 parts In-Stock

1+ parts

-

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4,298

-

-

-

-

Continental Prestige Electronics

USA . 3,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.246

10k+ parts

-

3,399

-

-

$0.246

-

SupplyDigital Components

Austria . 2,617 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,617

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TANS Electronics

Latvia . 551 parts In-Stock

1+ parts

-

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551

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Microchip USA

USA . 363 parts In-Stock

1+ parts

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363

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UHIMA Technologies

Türkiye . 273 parts In-Stock

1+ parts

-

100+ parts

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273

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-

-

Technical Specifications

Digital Shift Registers MC74HC595AFELG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC595AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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