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MC74HC4852ADG

Onsemi

MC74HC4852ADG by Onsemi

MC74HC4852ADG by Onsemi is a CMOS differential multiplexer with 4 channels. It operates at temperatures from -55 to 125 °C and has a max supply voltage of 6 V. With a nominal on-state resistance match of 240 ohm, it is suitable for military-grade applications requiring precise signal switching in compact spaces.

Median Price

$2.785

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 861 parts In-Stock

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$4.700

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$1.470

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$1.120

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861

$4.700

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$1.120

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DigiKey

USA . 768 parts In-Stock

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$0.870

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768

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$0.870

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Flip Electronics (Authorized)

USA . 768 parts In-Stock

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768

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Digiode

USA . 2,181 parts In-Stock

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$4.465

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$4.465

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Vyrian

USA . 6,862 parts In-Stock

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Flip Electronics

USA . 768 parts In-Stock

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768

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Distributors (Availability)

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Corohmni

South Africa . 460 parts In-Stock

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$0.870

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460

$0.870

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Corphita

USA . 969 parts In-Stock

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$4.230

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969

$4.230

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QUARKTWIN TECHNOLOGY LTD

USA . 25,822 parts In-Stock

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Metaverse IC Inc.

Canada . 5,260 parts In-Stock

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SupplyDigital Components

Austria . 5,209 parts In-Stock

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Microchip USA

USA . 5,154 parts In-Stock

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Perfect Parts

USA . 4,573 parts In-Stock

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Kulean Microsystems

USA . 2,641 parts In-Stock

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Problanco Electronics

Mexico . 2,550 parts In-Stock

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TANS Electronics

Latvia . 2,014 parts In-Stock

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GreenTree Electronics

Israel . 861 parts In-Stock

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Authorized Procurement Solutions

USA . 861 parts In-Stock

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861

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UHIMA Technologies

Türkiye . 515 parts In-Stock

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515

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Overview

Upgrade your electronic projects with the MC74HC4852ADG from Onsemi - a top-tier manufacturer known for quality and reliability. This versatile multiplexer & switch component offers seamless integration, precise functionality, and enhanced performance across a wide range of applications. With its compact design, dual terminal position, and advanced CMOS technology, this product ensures optimal efficiency and durability. Trust Onsemi to deliver superior solutions that provide unmatched value and benefits to customers seeking top-notch components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to damage, ensuring a longer lifespan.

No. of Functions: 2

Having 2 functions allows for increased flexibility and functionality in the product, making it suitable for a variety of applications.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V makes this product energy efficient and suitable for low power consumption applications.

Temperature Grade: MILITARY

The military-grade temperature grade ensures that the product can operate reliably in harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

The CMOS technology used in this product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a reliable choice.

Technical Specifications

Multiplexers & Switches MC74HC4852ADG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

2

No. of Terminals:

16

Nominal On-state Resistance Match:

240 ohm

Maximum On-state Resistance (Ron):

1300 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

200 ns

Maximum Switch-on Time:

200 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MC74HC4852ADG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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