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MC74HC377ADWG

Onsemi

MC74HC377ADWG by Onsemi

MC74HC377ADWG by Onsemi is an 8-bit latch with a supply voltage of 2-6V, operating b/w -55 to 125 °C. It features positive edge triggering, true output polarity, and a max I (ol) of 4A. Ideal for military-grade applications requiring small outline packages and surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,598 parts In-Stock

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Digiode

USA . 704 parts In-Stock

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AZTECH Wire

Italy . 248 parts In-Stock

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$22.180

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Problanco Electronics

Mexico . 5,375 parts In-Stock

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TANS Electronics

Latvia . 4,338 parts In-Stock

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SupplyDigital Components

Austria . 1,929 parts In-Stock

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Kulean Microsystems

USA . 1,694 parts In-Stock

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UHIMA Technologies

Türkiye . 470 parts In-Stock

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Microchip USA

USA . 239 parts In-Stock

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Corphita

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Corohmni

South Africa . 82 parts In-Stock

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Overview

Unlock the power of seamless data storage and retrieval with the MC74HC377ADWG by Onsemi. Crafted with precision and expertise, this small outline latch is designed to provide reliable performance in a variety of applications. Whether you're working on industrial automation or consumer electronics, this product offers unmatched quality and value. Benefit from fast trigger response, true output polarity, and a wide operating temperature range. Trust Onsemi for innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications

Surface Mount: YES

Easy to integrate onto circuit boards, saves space and improves efficiency

Package Shape: RECTANGULAR

Standard shape for easy handling and installation

No. of Bits: 8

Provides sufficient data storage capacity for many applications

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power supplies, easy to integrate

Power Supplies (V): 2/6

Flexible voltage input options for different power requirements

Temperature Grade: MILITARY

High-quality components for reliable performance in harsh environments

Technology: CMOS

Low power consumption and high noise immunity for efficient operation

Technical Specifications

Latches & Flip-Flops MC74HC377ADWG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

MC74HC377ADWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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