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MC74AC259MG

Onsemi

MC74AC259MG by Onsemi

MC74AC259MG by Onsemi is a CMOS latch with 17ns propagation delay, 5V nominal voltage, and 50pF load capacitance. Ideal for industrial applications requiring low-level trigger type flip-flops in small outline packages.

Median Price

$1.387

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

300

-

$1.240

$1.110

$1.040

DigiKey

USA . 300 parts In-Stock

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-

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$1.440

10k+ parts

$1.440

300

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$1.440

$1.440

Verical

USA . 300 parts In-Stock

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-

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-

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$1.387

10k+ parts

$1.300

300

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$1.387

$1.300

Distributors (In-Stock)

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Digiode

USA . 2,445 parts In-Stock

1+ parts

$1.311

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2,445

$1.311

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Vyrian

USA . 6,811 parts In-Stock

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6,811

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Distributors (Availability)

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Corphita

USA . 767 parts In-Stock

1+ parts

$1.242

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767

$1.242

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Corohmni

South Africa . 57 parts In-Stock

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$1.330

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57

$1.330

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Kulean Microsystems

USA . 7,328 parts In-Stock

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7,328

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Problanco Electronics

Mexico . 4,047 parts In-Stock

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4,047

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SupplyDigital Components

Austria . 3,521 parts In-Stock

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TANS Electronics

Latvia . 2,848 parts In-Stock

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Microchip USA

USA . 341 parts In-Stock

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Continental Prestige Electronics

USA . 300 parts In-Stock

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$1.150

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$1.150

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Overview

Enhance your electronic projects with the MC74AC259MG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The MC74AC259MG falls under the category of Latches & Flip-Flops, perfect for applications requiring fast response times and low power consumption. With a nominal supply voltage of 5V and a propagation delay of just 17ns, this small outline package offers superior performance. Trust Onsemi to provide you with cutting-edge technology that brings value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch durable and resistant to environmental factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 17 ns

The low propagation delay ensures fast response times, making this latch suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation convenient and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, providing compatibility with a wide range of devices.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and signal distortion, enhancing overall performance.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies offers flexibility in designing and integrating the latch into various systems.

Trigger Type: LOW LEVEL

The low-level trigger type ensures reliable and consistent operation, especially in noise-sensitive environments.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with various logic levels, making it ideal for modern electronic systems.

Technical Specifications

Latches & Flip-Flops MC74AC259MG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

5.275 mm

Trade Compliance

MC74AC259MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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