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MC54HC589AJ

Onsemi

MC54HC589AJ by Onsemi

MC54HC589AJ by Onsemi is an 8-bit digital shift register with CMOS technology. It operates in a temperature range of -55 to 125 °C, suitable for military-grade applications. The package style is in-line ceramic with 16 terminals and power supplies ranging from 2V to 6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,138 parts In-Stock

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Vyrian

USA . 273 parts In-Stock

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SupplyDigital Components

Austria . 6,901 parts In-Stock

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TANS Electronics

Latvia . 5,631 parts In-Stock

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Kulean Microsystems

USA . 5,074 parts In-Stock

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Problanco Electronics

Mexico . 2,599 parts In-Stock

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Corphita

USA . 1,539 parts In-Stock

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Corohmni

South Africa . 403 parts In-Stock

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UHIMA Technologies

Türkiye . 187 parts In-Stock

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Overview

Enhance your digital shift register applications with the MC54HC589AJ by Onsemi. Known for their top-quality manufacturing, Onsemi delivers reliable and durable products that meet the demands of various industries. This 8-bit shift register offers customers exceptional value and benefits, providing seamless integration and precise functionality. With a MILITARY temperature grade and a robust ceramic package body material, this product ensures optimal performance in extreme conditions. Upgrade your digital systems with the MC54HC589AJ and experience the advantage of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making the shift register resistant to high temperatures and thermal shock.

No. of Bits: 8

Having 8 bits allows for a wide range of data storage and manipulation capabilities, making the shift register versatile for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this shift register is suitable for applications where heat resistance is important.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the shift register energy-efficient and reliable in noisy environments.

Technical Specifications

Digital Shift Registers MC54HC589AJ attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MC54HC589AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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