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MC54HC139J

Onsemi

MC54HC139J by Onsemi

MC54HC139J by Onsemi is a CMOS Decoder & Drivers with 2 functions. It operates b/w -55 to 125 °C and supports supply voltage from 2V to 6V. Ideal for military-grade applications requiring inverted output polarity in a ceramic, metal-sealed co-fired package.

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Overview

Unlock the power of efficiency and reliability with the MC54HC139J by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products, and the MC54HC139J is no exception. This versatile decoder & driver is perfect for a wide range of applications, offering customers seamless functionality and peace of mind. With its inverted output polarity and military-grade temperature grade, this product ensures optimal performance even in the most demanding environments. Trust Onsemi to provide you with the best solutions for your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability in various operating conditions.

Input Conditioning: STANDARD

Standard input conditioning allows for easy integration with existing systems and components.

No. of Functions: 2

Having 2 functions in one product provides flexibility and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to arrange and mount the decoder & driver in different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of systems and power sources.

No. of Terminals: 16

With 16 terminals, this decoder & driver offers connectivity options for various input and output configurations.

Package Style (Meter): IN-LINE

The in-line package style allows for space-saving and efficient installation in compact systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures stability and performance even in extreme conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C enables reliable operation in cold environments.

Terminal Position: DUAL

The dual terminal position offers versatility in circuit connections and configurations.

Output Polarity: INVERTED

The inverted output polarity provides compatibility with various devices and systems that require inverted logic.

Minimum Supply Voltage (Vsup): 2V

With a minimum supply voltage of 2V, this decoder & driver can operate in low-power applications efficiently.

Temperature Grade: MILITARY

The military-grade temperature rating ensures ruggedness and reliability in harsh environments and mission-critical applications.

Technology: CMOS

Using CMOS technology provides high speed, low power consumption, and compatibility with a wide range of digital systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form factor allows for easy and secure soldering onto PCBs for stable connections.

Maximum Supply Voltage (Vsup): 6V

With a maximum supply voltage of 6V, this decoder & driver can handle higher voltage inputs safely and efficiently.

Technical Specifications

Decoder & Drivers MC54HC139J attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-CDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

MC54HC139J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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