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MC33364DG

Onsemi

MC33364DG by Onsemi

MC33364DG by Onsemi is a switching controller with current-mode control technique. It operates b/w -25 to 125 °C and has a max switching frequency of 800 kHz. Ideal for applications requiring pulse width modulation in small outline packages.

Median Price

$0.927

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$0.927

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870

$0.927

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Vyrian

USA . 7,417 parts In-Stock

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7,417

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Digiode

USA . 848 parts In-Stock

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848

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ComSIT Distribution GmbH

Germany . 33 parts In-Stock

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33

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Distributors (Availability)

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Ampacity Inc.

Singapore . 358 parts In-Stock

1+ parts

$0.500

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358

$0.500

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Corohmni

South Africa . 103 parts In-Stock

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$0.890

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103

$0.890

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Argo Parts USA

USA . 1,727 parts In-Stock

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$0.927

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1,727

$0.927

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Continental Prestige Electronics

USA . 102 parts In-Stock

1+ parts

$0.927

100+ parts

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10k+ parts

$0.908

102

$0.927

-

-

$0.908

Semicontronic

India . 501 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

501

$1.500

$1.462

$1.455

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$5.716

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565

$5.716

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Aztec Data Supply Inc.

USA . 1,719 parts In-Stock

1+ parts

$17.910

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1,719

$17.910

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TANS Electronics

Latvia . 5,614 parts In-Stock

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Kulean Microsystems

USA . 5,291 parts In-Stock

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SupplyDigital Components

Austria . 4,931 parts In-Stock

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4,931

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Problanco Electronics

Mexico . 2,463 parts In-Stock

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2,463

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Perfect Parts

USA . 1,240 parts In-Stock

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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441

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Microchip USA

USA . 407 parts In-Stock

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407

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Corphita

USA . 203 parts In-Stock

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203

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.908

1k+ parts

$0.881

10k+ parts

$0.862

100

-

$0.908

$0.881

$0.862

Overview

Unleash the power of efficient energy management with the MC33364DG from Onsemi. This switching regulator & controller offers top-notch quality and reliability, crafted by a manufacturer known for excellence. Perfect for a wide range of applications, this compact device provides superior performance and control mode for an optimized user experience. Say goodbye to inefficient energy consumption and hello to seamless operation with the MC33364DG. Experience the difference in quality and value that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in manufacturing.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control provides better transient response and superior noise immunity in switching regulators.

Nominal Input Voltage: 15.5 V

Suitable nominal input voltage for a variety of applications, offering flexibility in design.

Maximum Switching Frequency: 800 kHz

High switching frequency allows for efficient power conversion with minimal ripple in the output voltage.

Technical Specifications

Switching Regulators & Controllers MC33364DG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

20 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

15.5 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14/16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

800 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MC33364DG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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