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MC33274APG

Onsemi

MC33274APG by Onsemi

MC33274APG by Onsemi is a quad operational amplifier with 4 functions. It features a max input offset voltage of 1800 uV and a min slew rate of 8 V/us. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C and has a nominal unity gain bandwidth of 5500 kHz.

Median Price

$0.908

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

USA . 36,000 parts In-Stock

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Vyrian

USA . 7,426 parts In-Stock

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Digiode

USA . 1,046 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 14 parts In-Stock

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Holdelec - ElecDif-Pro

France . 14 parts In-Stock

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Greenchips

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Distributors (Availability)

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Argo Parts USA

USA . 3,087 parts In-Stock

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Continental Prestige Electronics

USA . 892 parts In-Stock

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$0.908

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$0.890

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Netroflash

USA . 100 parts In-Stock

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$0.908

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$0.863

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$0.844

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$0.844

Ampacity Inc.

Singapore . 676 parts In-Stock

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$1.410

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AZTECH Wire

Italy . 241 parts In-Stock

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$10.273

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QUARKTWIN TECHNOLOGY LTD

USA . 26,646 parts In-Stock

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SupplyDigital Components

Austria . 8,294 parts In-Stock

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Kulean Microsystems

USA . 7,182 parts In-Stock

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Problanco Electronics

Mexico . 5,239 parts In-Stock

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Microchip USA

USA . 5,041 parts In-Stock

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Corphita

USA . 2,255 parts In-Stock

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TANS Electronics

Latvia . 989 parts In-Stock

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UHIMA Technologies

Türkiye . 858 parts In-Stock

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Corohmni

South Africa . 495 parts In-Stock

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Overview

Enhance your electronic designs with the MC33274APG operational amplifier by Onsemi. Known for its high-quality manufacturing, Onsemi delivers reliable components that meet stringent industry standards. The MC33274APG is perfect for a variety of applications in the operational amplifiers category, offering customers exceptional value and performance. With low input offset voltage and bias current, this amplifier provides precision and accuracy in signal processing. Trust Onsemi to provide cutting-edge technology that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio ensures a better signal-to-noise ratio and reduces interference in the circuit.

Nominal Supply Voltage/Vsup (V): 15

A nominal supply voltage of 15V provides sufficient power for the operational amplifier to operate effectively.

Nominal Unity Gain Bandwidth: 5500 kHz

High unity gain bandwidth ensures stable operation and good performance over a wide range of frequencies.

Technology: BIPOLAR

The use of bipolar technology offers high gain, low noise, and low distortion for accurate signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) MC33274APG attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.5/±18/3/36 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

1800 uV

Minimum Voltage Gain:

19950

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

10 V/us

Peak Bias Current:

800 nA

Maximum Bias Current (IIB) @25 °C:

650 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

12 mA

Physical Characteristics

Length:

0.743 in (18.86 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.185 in (4.69 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Rail

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

MC33274APG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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