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MC33264DM-3.0R2

Onsemi

MC33264DM-3.0R2 by Onsemi

MC33264DM-3.0R2 by Onsemi is a fixed positive single output LDO regulator with 3% voltage tolerance, 0.01% line regulation, and 0.025% load regulation. Ideal for applications requiring a small outline package, it operates b/w -40 to 125 °C with a max input voltage of 13V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,025 parts In-Stock

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Vyrian

USA . 217 parts In-Stock

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Problanco Electronics

Mexico . 6,541 parts In-Stock

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Kulean Microsystems

USA . 3,342 parts In-Stock

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SupplyDigital Components

Austria . 1,661 parts In-Stock

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TANS Electronics

Latvia . 1,434 parts In-Stock

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UHIMA Technologies

Türkiye . 632 parts In-Stock

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Corphita

USA . 383 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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Overview

Discover the high-quality MC33264DM-3.0R2 regulator from Onsemi, a leading manufacturer in the industry. This versatile regulator is perfect for a wide range of applications, providing stable output voltage with minimal dropout. With its compact design and reliable performance, this product offers customers exceptional value and peace of mind. Upgrade your electronics with the MC33264DM-3.0R2 for efficient power management and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Dropout Voltage: 1.23 V

Low dropout voltage ensures efficient power regulation and minimal power loss, making it suitable for power-sensitive devices.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range makes the regulator suitable for use in various environmental conditions.

Technology: BIPOLAR

Bipolar technology provides stable and reliable performance, essential for precision voltage regulation applications.

Nominal Output Voltage-1: 3 V

Provides a steady output voltage of 3V, suitable for powering a wide range of electronic devices.

Minimum Input Voltage: 4 V

Low minimum input voltage requirement allows the regulator to operate efficiently even with lower input power sources.

Maximum Output Current-1: 0.1 A

Capable of delivering up to 0.1A of current, making it suitable for powering low to moderately power-consuming devices.

Technical Specifications

Other Function Regulators MC33264DM-3.0R2 attributes and parameters. Explore more Other Function Regulators devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.23 V

Nominal Dropout Voltage-1:

.147 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

12 V

Minimum Input Voltage:

4 V

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Maximum Line Regulation:

.01 %

Maximum Load Regulation:

.025 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

3.1 V

Minimum Output Voltage-1:

2.9 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

MC33264DM-3.0R2 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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