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MC33264D-3.3R2

Onsemi

MC33264D-3.3R2 by Onsemi

MC33264D-3.3R2 by Onsemi is a fixed positive single output LDO regulator with 3.3V nominal output voltage, 0.1A max output current, and 4% max voltage tolerance. It is used in applications requiring stable voltage regulation in a compact package, suitable for surface mount assembly at temperatures ranging from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,453 parts In-Stock

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Digiode

USA . 486 parts In-Stock

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TANS Electronics

Latvia . 5,977 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,817 parts In-Stock

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SupplyDigital Components

Austria . 5,086 parts In-Stock

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Kulean Microsystems

USA . 5,033 parts In-Stock

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Corphita

USA . 1,623 parts In-Stock

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UHIMA Technologies

Türkiye . 423 parts In-Stock

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Corohmni

South Africa . 107 parts In-Stock

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Problanco Electronics

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Overview

Unlock the power of reliable voltage regulation with the MC33264D-3.3R2 by Onsemi. Known for their superior quality and cutting-edge technology, Onsemi has created a game-changer in the world of regulators. This product is perfect for a wide range of applications, providing stable and precise output voltages with minimal dropout. Say goodbye to worries about fluctuating power supply and hello to smooth, consistent performance. Upgrade your electronics with the MC33264D-3.3R2 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the longevity and portability of the regulator.

Maximum Dropout Voltage: 1.23 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for versatility in various environments.

Technology: BIPOLAR

Reliable bipolar technology ensures stable performance and precision.

Minimum Output Voltage: 3.18 V

Provides a consistent minimum output voltage for reliable device operation.

Nominal Output Voltage: 3.3 V

Stable output voltage ensures consistent power supply to connected components.

Maximum Operating Temperature: 85 °C

Efficient heat dissipation and operation in moderate ambient temperatures.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Specifically designed for low dropout applications requiring a fixed positive output voltage.

Maximum Output Current: 0.1 A

Supports low to moderate power requirements for various electronic devices.

Technical Specifications

Other Function Regulators MC33264D-3.3R2 attributes and parameters. Explore more Other Function Regulators devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.23 V

Nominal Dropout Voltage-1:

.147 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

12 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Maximum Line Regulation:

.01 %

Maximum Load Regulation:

.025 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

3.42 V

Minimum Output Voltage-1:

3.18 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

4 %

Width:

3.9 mm

Trade Compliance

MC33264D-3.3R2 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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