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MC33172VDG

Onsemi

MC33172VDG by Onsemi

MC33172VDG by Onsemi is a dual operational amplifier with 6500uV max input offset voltage, 90dB CMRR, and 1.6V/us min slew rate. Ideal for automotive applications due to its micropower feature and -40 to 125 °C operating temperature range. It comes in a small outline package with tin terminal finish.

Median Price

$0.519

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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$0.519

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Vyrian

USA . 6,546 parts In-Stock

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Digiode

USA . 2,191 parts In-Stock

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Prism Electronics

USA . 473 parts In-Stock

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473

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Chip Stock

USA . 145 parts In-Stock

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145

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Distributors (Availability)

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Ampacity Inc.

Singapore . 126 parts In-Stock

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$0.400

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126

$0.400

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Semicontronic

India . 126 parts In-Stock

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$0.400

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$0.390

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$0.388

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126

$0.400

$0.390

$0.388

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Benley Electronics

USA . 25 parts In-Stock

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$0.400

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25

$0.400

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Corohmni

South Africa . 437 parts In-Stock

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$0.471

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437

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Argo Parts USA

USA . 217 parts In-Stock

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$0.519

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$0.503

217

$0.519

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$0.503

Bastille Electronics

Australia . 129 parts In-Stock

1+ parts

$0.519

100+ parts

$0.493

1k+ parts

$0.468

10k+ parts

$0.462

129

$0.519

$0.493

$0.468

$0.462

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.529

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$0.529

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$0.529

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600

$0.529

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Aztec Data Supply Inc.

USA . 4,365 parts In-Stock

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$3.760

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AZTECH Wire

Italy . 249 parts In-Stock

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$17.013

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Component Stockers USA

USA . 483 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,317 parts In-Stock

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Kulean Microsystems

USA . 6,460 parts In-Stock

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SupplyDigital Components

Austria . 4,257 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 2,347 parts In-Stock

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Perfect Parts

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Kepictronics

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Infinite Electronics LLP (Excess)

. 838 parts In-Stock

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UHIMA Technologies

Türkiye . 442 parts In-Stock

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Microchip USA

USA . 426 parts In-Stock

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Problanco Electronics

Mexico . 142 parts In-Stock

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Continental Prestige Electronics

USA . 126 parts In-Stock

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$0.471

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Overview

Elevate your electronic designs with the MC33172VDG operational amplifier from Onsemi. Crafted with precision and expertise, this high-quality component offers exceptional performance and reliability for a wide range of applications. With its advanced features and cutting-edge technology, this op amp provides superior functionality and efficiency, delivering unparalleled value to customers. Trust Onsemi for innovation, trust the MC33172VDG for excellence in operational amplifiers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes in manufacturing.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and storage capabilities.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily mountable on circuit boards.

Bit Size: 8

An 8-bit architecture supports a wide range of applications and provides sufficient processing power.

DAC Channels: YES

Having digital to analog converter channels allows for analog signal output, useful in various applications.

No. of Terminals: 14

With 14 terminals, there are more connection options available for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and suits compact designs.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the product suitable for industrial applications where heat may be a factor.

CPU Family: AVR RISC

The AVR RISC architecture offers high performance and efficiency, making it a popular choice for microcontrollers.

No. of External Interrupts: 12

Having 12 external interrupts allows the microcontroller to respond quickly to external events or signals.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

ADC Channels: YES

Analog to digital converter channels enable the microcontroller to read analog sensor inputs accurately.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options and board design.

ROM Words: 2048

With 2048 ROM words, the microcontroller can store a significant amount of program instructions.

Maximum Seated Height: 1.75 mm

A low maximum seated height saves space and allows for thinner device designs.

Digital To Analog Convertors: 1-Ch 8-Bit

Having a single channel 8-bit DAC provides analog output capabilities.

RAM Words: 128

128 RAM words offer sufficient memory for data storage and manipulation.

Width: 3.9 mm

The narrow width of 3.9 mm allows for compact and space-efficient PCB layouts.

Data EEPROM Size: 64

A data EEPROM size of 64 ensures non-volatile data storage for critical information.

Peripherals: BOD, POR, COMPARATOR, TIMER(3)

The included peripherals enhance the functionality and usability of the microcontroller in various applications.

Maximum Clock Frequency: 20 MHz

A high maximum clock frequency of 20 MHz allows for fast execution of instructions and high-speed data processing.

Length: 8.65 mm

The length of 8.65 mm is compact, making it suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, it offers efficient performance and low power consumption.

No. of Timers: 3

Having 3 timers allows for precise timing control and event management in applications.

RAM Bytes: 128

128 RAM bytes provide adequate memory for storing variables and intermediate computation results.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving energy efficiency.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connection on the PCB.

Analog To Digital Convertors: 10-Ch 10-Bit

With 10-channel 10-bit ADC, the microcontroller can handle multiple analog inputs with high resolution.

Maximum Supply Current: 200 mA

The maximum supply current of 200 mA ensures stable operation under varying load conditions.

Nominal Supply Voltage: 5 V

A 5V nominal supply voltage is common and widely supported, making it convenient for most applications.

PWM Channels: YES

The presence of PWM channels enables the microcontroller to generate precise analog output signals for motor control and other applications.

Connectivity: I2C, SPI, USART

Support for I2C, SPI, and USART connectivity allows for easy communication with other devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating and reprogramming of the firmware without needing external programming tools.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm ensures compatibility with common PCB layouts and connectors.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and is suitable for many embedded applications.

Speed: 20 rpm

With a speed of 20 rpm, the microcontroller can handle tasks efficiently without sacrificing performance.

Low Power Mode: YES

The low power mode allows for power-efficient operation, extending battery life in portable devices.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 bits enables the storage of program instructions for execution.

No. of I/O Lines: 12

Having 12 I/O lines provides flexibility for interfacing with various external devices and peripherals.

Technical Specifications

Operational Amplifiers (Op Amps) MC33172VDG attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

1.6 V/us

Nominal Slew Rate:

2.1 V/us

Peak Bias Current:

200 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

600 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Rail

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

MC33172VDG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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