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MC33077PG

Onsemi

MC33077PG by Onsemi

MC33077PG by Onsemi is an Operational Amplifier with 1500uV Max Input Offset Voltage, 1.2uA Max Average Bias Current, and 107dB Nominal CMRR. Widely used in industrial applications for its 8-pin IN-LINE package style and BIPOLAR technology offering a Unity Gain Bandwidth of 7500kHz.

Median Price

$0.795

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,176 parts In-Stock

1+ parts

-

100+ parts

$0.766

1k+ parts

$0.636

10k+ parts

$0.567

3,176

-

$0.766

$0.636

$0.567

DigiKey

USA . 3,176 parts In-Stock

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-

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$0.960

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3,176

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$0.960

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Verical

USA . 1,380 parts In-Stock

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$0.795

10k+ parts

$0.709

1,380

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-

$0.795

$0.709

Distributors (In-Stock)

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Digiode

USA . 711 parts In-Stock

1+ parts

$0.597

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711

$0.597

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Vyrian

USA . 8,076 parts In-Stock

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Chip Stock

USA . 6,220 parts In-Stock

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DigiKey Marketplace

USA . 3,176 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 97 parts In-Stock

1+ parts

$0.565

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97

$0.565

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Corohmni

South Africa . 53 parts In-Stock

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$0.628

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53

$0.628

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AZTECH Wire

Italy . 793 parts In-Stock

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$11.940

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$11.940

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QUARKTWIN TECHNOLOGY LTD

USA . 9,921 parts In-Stock

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Microchip USA

USA . 5,499 parts In-Stock

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Continental Prestige Electronics

USA . 3,176 parts In-Stock

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$0.594

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$0.594

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Kulean Microsystems

USA . 2,895 parts In-Stock

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TANS Electronics

Latvia . 1,699 parts In-Stock

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UHIMA Technologies

Türkiye . 888 parts In-Stock

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Problanco Electronics

Mexico . 395 parts In-Stock

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Kepictronics

USA . 85 parts In-Stock

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SupplyDigital Components

Austria . 78 parts In-Stock

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Overview

Enhance your electronic designs with the MC33077PG operational amplifier from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. This versatile op amp offers outstanding performance and reliability, making it ideal for a wide range of applications. With low bias current, high common mode rejection ratio, and fast slew rate, the MC33077PG provides exceptional value and benefits to customers seeking precision and efficiency in their projects. Upgrade your designs today with the MC33077PG and experience superior amplification like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Maximum Input Offset Voltage: 1500 uV

Low offset voltage helps in minimizing errors in signal processing.

Nominal Supply Voltage / Vsup (V): 15

Standard supply voltage allows for easy integration into existing systems.

Minimum Slew Rate: 8 V/us

Fast slew rate enables quick response to input signals.

Nominal Unity Gain Bandwidth: 7500 kHz

High unity gain bandwidth indicates strong performance in various applications.

Technical Specifications

Operational Amplifiers (Op Amps) MC33077PG attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

7.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

107 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

125000

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

11 V/us

Peak Bias Current:

1.2 uA

Maximum Bias Current (IIB) @25 °C:

1 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

4.8 mA

Physical Characteristics

Length:

0.385 in (9.78 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.175 in (4.45 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Rail

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

MC33077PG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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