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MC33060APG

Onsemi

MC33060APG by Onsemi

MC33060APG by Onsemi is a switching controller with voltage-mode control technique. It operates in industrial temperature range from -40 to 85 °C and supports a max output current of 0.5 A at a max switching frequency of 200 kHz. Ideal for applications requiring pulse width modulation in power supplies.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,112 parts In-Stock

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Digiode

USA . 802 parts In-Stock

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AZTECH Wire

Italy . 92 parts In-Stock

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$8.250

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TANS Electronics

Latvia . 7,476 parts In-Stock

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Perfect Parts

USA . 4,134 parts In-Stock

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Kulean Microsystems

USA . 3,657 parts In-Stock

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SupplyDigital Components

Austria . 2,573 parts In-Stock

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Problanco Electronics

Mexico . 2,232 parts In-Stock

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Corphita

USA . 1,590 parts In-Stock

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UHIMA Technologies

Türkiye . 642 parts In-Stock

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Microchip USA

USA . 495 parts In-Stock

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Corohmni

South Africa . 60 parts In-Stock

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Overview

Upgrade your power management system with the MC33060APG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality switching regulators & controllers that guarantee reliable performance. Ideal for a wide range of applications, this product offers customers enhanced efficiency and precision control, making it a valuable addition to any project. With a focus on innovation and durability, Onsemi's MC33060APG provides users with the advantage of optimal power management solutions that meet their unique needs. Trust Onsemi to elevate your power management capabilities with the MC33060APG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material ensures lightweight and durable construction, ideal for applications requiring portability and long-term use.

No. of Terminals: 14

Higher number of terminals allows for more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation and stability for efficient power management.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good conductivity and corrosion resistance for long-lasting connections.

Width (mm): 7.62 mm

Compact width allows for space-efficient integration into tight circuit layouts.

Nominal Input Voltage: 15 V

Optimal nominal input voltage ensures compatibility with a wide range of power sources.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature handling ensures reliable performance in harsh operating conditions.

Maximum Output Current: 0.5 A

High maximum output current capability makes it suitable for demanding power requirements.

Technical Specifications

Switching Regulators & Controllers MC33060APG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

7 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.48 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.69 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

200 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

MC33060APG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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