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MC1489DR2G

Onsemi

MC1489DR2G by Onsemi

MC1489DR2G by Onsemi is a 4-function line driver/receiver with 5V power supply, operating b/w 0-75 °C. It features EIA-232-D interface standard, Schmitt trigger input characteristics, and Gull Wing terminal form. Ideal for commercial extended temperature grade applications requiring a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,056 parts In-Stock

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Chip Stock

USA . 3,280 parts In-Stock

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Digiode

USA . 974 parts In-Stock

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Bristol Electronics

USA . 376 parts In-Stock

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Flex Direct, LLC

USA . 376 parts In-Stock

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Zilex Electronics Inc.

Canada . 57 parts In-Stock

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AZTECH Wire

Italy . 956 parts In-Stock

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$19.420

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Component Stockers USA

USA . 585 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,736 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,087 parts In-Stock

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Microchip USA

USA . 5,646 parts In-Stock

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Problanco Electronics

Mexico . 3,861 parts In-Stock

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TANS Electronics

Latvia . 2,379 parts In-Stock

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Corphita

USA . 1,700 parts In-Stock

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Authorized Procurement Solutions

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Corohmni

South Africa . 471 parts In-Stock

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UHIMA Technologies

Türkiye . 271 parts In-Stock

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SupplyDigital Components

Austria . 188 parts In-Stock

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Kepictronics

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ChipstoGo Electronic ltd

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Overview

Enhance your communication systems with the MC1489DR2G by Onsemi! Manufactured to the highest standards, this line driver & receiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures seamless transmission of data with its advanced technology. Experience the value of clear, fast and efficient communication with the MC1489DR2G - the perfect solution for all your networking needs. Unlock the benefits today and elevate your connectivity with Onsemi's top-of-the-line product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages for compatibility with various systems.

No. of Functions: 4

Multiple functions provide flexibility and versatility in usage.

Package Shape: RECTANGULAR

Rectangular shape enables efficient space utilization on PCBs.

Power Supplies (V): 5

Stable power supply of 5V ensures consistent performance.

No. of Terminals: 14

Sufficient number of terminals for connectivity and signal transmission.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and enhances portability.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage allows for operation in diverse environments.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures reliability in harsh conditions.

Minimum Operating Temperature: 0 °C

Wide temperature range allows for operation in varying climates.

Terminal Finish: Tin (Sn)

Tin terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position enables versatile installation options.

Maximum Seated Height: 1.75 mm

Low seated height minimizes space requirements in electronic devices.

Width: 3.9 mm

Narrow width facilitates compact design and integration into tight spaces.

Maximum Output Low Current: 10 Amp

High output current capability supports robust signal transmission.

Receiver No. of Bits: 4

4 bits resolution for precise data reception and transmission.

Maximum Time At Peak Reflow Temperature (s): 40

Sustainable at peak reflow temperature for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature withstands soldering processes without damage.

Length: 8.65 mm

Compact length for space-saving installation in electronic systems.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation in various environments.

Maximum Receive Delay: 85 ns

Low receive delay time for fast and responsive data transmission.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections on PCBs.

Interface Standard: EIA-232-D

Conforms to industry-standard interface for compatibility with a wide range of devices.

Maximum Supply Current: 26 mA

Low supply current consumption for energy-efficient operation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics for noise immunity and signal stability.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch for compact design and efficient wiring.

Interface IC Type: LINE RECEIVER

Line receiver interface IC type for reliable signal reception and transmission.

Technical Specifications

Line Drivers & Receivers MC1489DR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

RESPONSE CONTROL

Differential Output:

NO

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-D

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

14

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

10 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

85 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MC1489DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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