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MC12095DG

Onsemi

MC12095DG by Onsemi

MC12095DG by Onsemi is a prescaler & multivibrator with 3/5V power supplies, 2.7-5.5V supply voltage range, and 2500MHz min fmax. It is used in industrial applications requiring high-frequency operation in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,481 parts In-Stock

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Digiode

USA . 1,043 parts In-Stock

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Sensible Micro Corp

USA . 264 parts In-Stock

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264

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Distributors (Availability)

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AZTECH Wire

Italy . 224 parts In-Stock

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$19.390

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224

$19.390

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Component Stockers USA

USA . 757 parts In-Stock

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$99.990

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757

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QUARKTWIN TECHNOLOGY LTD

USA . 22,895 parts In-Stock

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Problanco Electronics

Mexico . 8,129 parts In-Stock

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Kepictronics

USA . 7,800 parts In-Stock

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7,800

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Microchip USA

USA . 6,138 parts In-Stock

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TANS Electronics

Latvia . 4,833 parts In-Stock

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Kulean Microsystems

USA . 2,795 parts In-Stock

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2,795

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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Corphita

USA . 130 parts In-Stock

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Corohmni

South Africa . 98 parts In-Stock

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SupplyDigital Components

Austria . 15 parts In-Stock

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Overview

Unleash the power of precision with the MC12095DG by Onsemi. Crafted with excellence, this prescaler & multivibrator offers unparalleled quality and reliability. Designed for industrial-grade applications, this small outline package delivers exceptional performance in a wide range of environments. With a maximum frequency of 2.5 GHz, dual terminal position, and a tin finish, this product ensures seamless integration and optimal functionality. Elevate your projects with the MC12095DG and experience the superior value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight is a concern and durability is required.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes, saving time and cost in production.

Power Supplies (V): 3/5

The versatile power supply options of 3V and 5V make this product compatible with a wide range of electronic systems, providing flexibility in design and integration.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand elevated temperature environments, ensuring reliable performance in various conditions.

Maximum Frequency At Nominal Supply: 2500000000 Hz

The high maximum frequency capability of 2.5 GHz allows for fast signal processing and high-speed operation, making it suitable for applications requiring high-frequency performance.

Technical Specifications

Prescaler & Multivibrators MC12095DG attributes and parameters. Explore more Prescaler & Multivibrators devices from Onsemi

Specs

Family:

ECL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2500000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Maximum Power Supply Current (ICC):

14 mA

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

2500 MHz

Trade Compliance

MC12095DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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