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MAX803SQ438T1G

Onsemi

MAX803SQ438T1G by Onsemi

MAX803SQ438T1G by Onsemi is a Power Management IC with 3.3V Nominal Voltage, 1.2/5.5V Power Supplies, and +4.38V Nominal Threshold Voltage. It is used in industrial applications for power supply support circuits due to its small outline, thin profile package style, and wide operating temperature range of -40 to 105 °C.

Median Price

$0.215

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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18,000

-

-

-

-

Rochester

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$0.215

1k+ parts

$0.179

10k+ parts

$0.159

120

-

$0.215

$0.179

$0.159

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,267 parts In-Stock

1+ parts

$0.167

100+ parts

-

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2,267

$0.167

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Vyrian

USA . 6,741 parts In-Stock

1+ parts

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6,741

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-

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-

Chip Stock

USA . 4,510 parts In-Stock

1+ parts

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4,510

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ComSIT Distribution GmbH

Germany . 800 parts In-Stock

1+ parts

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800

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 876 parts In-Stock

1+ parts

$0.158

100+ parts

-

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876

$0.158

-

-

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Corohmni

South Africa . 375 parts In-Stock

1+ parts

$0.176

100+ parts

-

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375

$0.176

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Microchip USA

USA . 4,291 parts In-Stock

1+ parts

$1.356

100+ parts

-

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4,291

$1.356

-

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AZTECH Wire

Italy . 645 parts In-Stock

1+ parts

$14.180

100+ parts

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645

$14.180

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Perfect Parts

USA . 45,226 parts In-Stock

1+ parts

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45,226

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SupplyDigital Components

Austria . 7,226 parts In-Stock

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7,226

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Kulean Microsystems

USA . 6,275 parts In-Stock

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6,275

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TANS Electronics

Latvia . 5,027 parts In-Stock

1+ parts

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5,027

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Problanco Electronics

Mexico . 1,709 parts In-Stock

1+ parts

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100+ parts

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1,709

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UHIMA Technologies

Türkiye . 97 parts In-Stock

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97

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Overview

Discover the MAX803SQ438T1G by Onsemi, a top-quality Power Management IC that brings reliability and efficiency to your applications. Manufactured by Onsemi, a trusted name in the industry, this IC offers a wide operating temperature range and low power consumption, making it ideal for industrial use. With a compact design and high-performance features, this IC provides value and benefits that will enhance your electronic projects. Upgrade your power management system with the MAX803SQ438T1G and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material allows for durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard, making it compatible with a wide range of devices and power sources.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, this product can withstand harsh environmental conditions and maintain stable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable for power management applications.

Technical Specifications

Power Management ICs MAX803SQ438T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.38V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.24 mm

Trade Compliance

MAX803SQ438T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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