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MAX803SQ293D3T1G

Onsemi

MAX803SQ293D3T1G by Onsemi

MAX803SQ293D3T1G by Onsemi is a Power Management IC with 3.3V nominal voltage and 1.2/5.5V power supplies range. It features a small outline package style, suitable for industrial applications requiring low power consumption and precise voltage thresholds. With a wide operating temperature range of -40 to 105°C, it is ideal for various electronic devices needing reliable power management solutions.

Median Price

$0.160

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$0.160

100+ parts

-

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3

$0.160

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Distributors (In-Stock)

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Digiode

USA . 1,040 parts In-Stock

1+ parts

$0.152

100+ parts

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1,040

$0.152

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.247

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10

$0.247

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Vyrian

USA . 5,518 parts In-Stock

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5,518

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Inventory MP

USA . 2,750 parts In-Stock

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2,750

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Bristol Electronics

USA . 1,750 parts In-Stock

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1,750

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ComSIT Distribution GmbH

Germany . 1,545 parts In-Stock

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ComSIT USA

USA . 1,545 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,024 parts In-Stock

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Prism Electronics

USA . 80 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,128 parts In-Stock

1+ parts

$0.136

100+ parts

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1,128

$0.136

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Semicontronic

India . 3 parts In-Stock

1+ parts

$0.136

100+ parts

$0.133

1k+ parts

$0.132

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3

$0.136

$0.133

$0.132

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Corphita

USA . 1,480 parts In-Stock

1+ parts

$0.144

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1,480

$0.144

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Corohmni

South Africa . 418 parts In-Stock

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$0.160

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418

$0.160

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Argo Parts USA

USA . 4,381 parts In-Stock

1+ parts

$0.219

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$0.212

4,381

$0.219

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$0.212

Continental Prestige Electronics

USA . 2,153 parts In-Stock

1+ parts

$0.219

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$0.215

2,153

$0.219

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$0.215

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.242

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$0.232

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2,000

$0.242

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$0.232

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Vigor

Singapore . 504 parts In-Stock

1+ parts

$0.550

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504

$0.550

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$5.205

100+ parts

$4.737

1k+ parts

$4.268

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10

$5.205

$4.737

$4.268

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$12.652

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744

$12.652

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Aztec Data Supply Inc.

USA . 4,213 parts In-Stock

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$23.390

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$23.390

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Kepictronics

USA . 18,000 parts In-Stock

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Lixinc

USA . 13,796 parts In-Stock

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TANS Electronics

Latvia . 6,963 parts In-Stock

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SupplyDigital Components

Austria . 5,889 parts In-Stock

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Kulean Microsystems

USA . 5,273 parts In-Stock

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Problanco Electronics

Mexico . 861 parts In-Stock

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UHIMA Technologies

Türkiye . 373 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 63 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MAX803SQ293D3T1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Power Management ICs that are essential for various applications. This small outline, very thin profile package offers a nominal supply voltage of 3.3V and a wide power supply range of 1.2V to 5.5V. With a temperature grade of industrial and dual terminal position, this IC provides superior quality and efficiency. Trust Onsemi to provide you with the best power supply support circuit technology for your needs. Elevate your projects with the MAX803SQ293D3T1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides a durable and cost-effective solution.

Surface Mount: YES

Being surface mount compatible allows for easy and reliable installation on PCBs.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into various designs and layouts.

Nominal Supply Voltage (Vsup): 3.3V

A nominal supply voltage of 3.3V makes this product compatible with a wide range of applications.

Power Supplies (V): 1.2/5.5

This product supports a power supply range of 1.2V to 5.5V, making it versatile in different scenarios.

No. of Terminals: 3

With 3 terminals, this product offers simplified connections for efficient power management.

Package Style: SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The small outline and thin profile design make this power management IC ideal for space-constrained applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good conductivity and solderability for secure connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and layout options.

Maximum Seated Height: 1 mm

The low maximum seated height makes this IC suitable for slim and compact designs.

Width (mm): 1.24 mm

The narrow width of 1.24mm allows for efficient space utilization on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC is specifically designed to support power supply functions, ensuring optimal performance.

Minimum Supply Voltage (Vsup): 1.2V

With a minimum supply voltage of 1.2V, this IC is compatible with low-power applications.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature simplifies the manufacturing process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand the soldering process without any issues.

Length: 2.1 mm

A length of 2.1mm provides a compact and space-efficient design for various applications.

Nominal Threshold Voltage (V): +2.93V

The nominal threshold voltage of +2.93V ensures precise voltage sensing and regulation.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this power management IC offers reliability and durability.

Maximum Supply Current (Isup): 0.0025 mA

With a low maximum supply current of 0.0025mA, this IC helps in reducing power consumption.

Technology: CMOS

The use of CMOS technology ensures low power consumption and compatibility with a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and ease of soldering.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this IC enables compact layout designs on the PCB.

Maximum Supply Voltage (Vsup): 5.5V

The maximum supply voltage of 5.5V provides flexibility in the power input range for various applications.

Technical Specifications

Power Management ICs MAX803SQ293D3T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.24 mm

Trade Compliance

MAX803SQ293D3T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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