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LV8762T-TLM-H

Onsemi

LV8762T-TLM-H by Onsemi

LV8762T-TLM-H by Onsemi is a peripheral driver with 24 terminals, operating voltage range of 9-32V. It offers built-in protections against transient, over current, and thermal issues. Ideal for applications requiring a half bridge based peripheral driver in compact spaces.

Median Price

$1.362

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$1.557

100+ parts

$1.207

1k+ parts

$1.109

10k+ parts

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1

$1.557

$1.207

$1.109

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Rochester

USA . 73,725 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$0.988

10k+ parts

$0.881

73,725

-

$1.190

$0.988

$0.881

DigiKey

USA . 73,725 parts In-Stock

1+ parts

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$1.490

10k+ parts

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73,725

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$1.490

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Verical

USA . 72,000 parts In-Stock

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$1.235

10k+ parts

$1.101

72,000

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$1.235

$1.101

Flip Electronics (Authorized)

USA . 20,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 580 parts In-Stock

1+ parts

$0.926

100+ parts

-

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580

$0.926

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Bristol Electronics

USA . 545 parts In-Stock

1+ parts

$1.950

100+ parts

$1.209

1k+ parts

$0.731

10k+ parts

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545

$1.950

$1.209

$0.731

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Chip Stock

USA . 36,000 parts In-Stock

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36,000

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Flip Electronics

USA . 20,000 parts In-Stock

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Vyrian

USA . 6,819 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 545 parts In-Stock

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545

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Dan-Mar Components

USA . 545 parts In-Stock

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545

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Distributors (Availability)

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Corohmni

South Africa . 298 parts In-Stock

1+ parts

$0.817

100+ parts

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298

$0.817

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Corphita

USA . 1,452 parts In-Stock

1+ parts

$0.878

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1,452

$0.878

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$11.487

100+ parts

$10.453

1k+ parts

$9.419

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450

$11.487

$10.453

$9.419

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AZTECH Wire

Italy . 708 parts In-Stock

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$17.910

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708

$17.910

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Problanco Electronics

Mexico . 8,297 parts In-Stock

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Perfect Parts

USA . 3,501 parts In-Stock

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TANS Electronics

Latvia . 2,662 parts In-Stock

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2,662

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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SupplyDigital Components

Austria . 1,782 parts In-Stock

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1,782

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Microchip USA

USA . 254 parts In-Stock

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254

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Kulean Microsystems

USA . 93 parts In-Stock

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UHIMA Technologies

Türkiye . 74 parts In-Stock

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74

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Overview

Enhance your electronic designs with the LV8762T-TLM-H by Onsemi, a top-of-the-line peripheral driver that guarantees quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers built-in protections against transient, over current, and thermal issues. Ideal for a wide range of applications, this compact and efficient device provides customers with seamless operation and superior performance. Elevate your projects with the LV8762T-TLM-H and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

Being surface mountable makes installation and integration of this peripheral driver easier and more convenient in electronic circuit designs.

Maximum Supply Voltage: 32 V

With a high maximum supply voltage of 32 V, this peripheral driver is suitable for a wide range of applications that require higher voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape allows for a more compact and space-efficient design when incorporating this peripheral driver into electronic devices.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections ensure the safety and reliability of the peripheral driver by safeguarding against transient voltage fluctuations, over-current situations, and thermal overload conditions.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting this peripheral driver to various components and interfaces within a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this peripheral driver suitable for compact and space-constrained electronic applications.

Minimum Supply Voltage: 9 V

The low minimum supply voltage of 9 V allows for compatibility with a range of power sources and voltage levels in different electronic systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C enables this peripheral driver to function effectively in cold temperature conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides corrosion resistance and ensures good electrical conductivity for reliable connections.

Terminal Position: DUAL

The dual terminal position allows for flexibility in orientation and mounting options when integrating this peripheral driver into a circuit.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm enables a low-profile design for electronic devices where space is limited.

Width: 4.4 mm

The narrow width of 4.4 mm facilitates compact placement and integration of this peripheral driver in electronic assemblies.

Length: 6.5 mm

The short length of 6.5 mm contributes to a space-saving design when incorporating this peripheral driver into electronic systems.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and mounting on circuit boards, ensuring a secure and reliable connection.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24 V is commonly used in many electronic systems, making this peripheral driver compatible with a wide range of applications.

Turn-on Time: 0.75 us

The fast turn-on time of 0.75 microseconds ensures quick response and switching capabilities for efficient operation of the peripheral driver.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and compact layout of components in electronic circuits.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this peripheral driver is suitable for use in environments with moderate exposure to moisture.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The interface IC type of half bridge based peripheral driver offers efficient control and management of peripheral devices in electronic systems.

Turn-off Time: 0.75 us

The fast turn-off time of 0.75 microseconds ensures responsive and precise operation of the peripheral driver's output.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink output current allows for bidirectional flow of current in the peripheral driver, providing versatile functionality for various applications.

Technical Specifications

Peripheral Drivers LV8762T-TLM-H attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

9 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Turn-off Time:

.75 us

Turn-on Time:

.75 us

Width:

4.4 mm

Trade Compliance

LV8762T-TLM-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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