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LV8762T-MPB-H

Onsemi

LV8762T-MPB-H by Onsemi

LV8762T-MPB-H by Onsemi is a half bridge peripheral driver with built-in protections. It operates b/w -20 to 85 °C, with max supply voltage of 32 V and min of 9 V. Ideal for applications requiring source/sink output current flow direction in compact spaces.

Median Price

$1.039

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 22 parts In-Stock

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$0.828

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Chip1Stop

Japan . 22 parts In-Stock

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$1.250

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Verical

USA . 22 parts In-Stock

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Digiode

USA . 1,635 parts In-Stock

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$0.787

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Vyrian

USA . 8,272 parts In-Stock

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Nova Conductors

Japan . 48 parts In-Stock

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Ampacity Inc.

Singapore . 22 parts In-Stock

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$0.700

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22

$0.700

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Semicontronic

India . 22 parts In-Stock

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$0.700

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$0.682

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$0.679

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22

$0.700

$0.682

$0.679

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Corphita

USA . 1,183 parts In-Stock

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$0.745

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$0.745

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Corohmni

South Africa . 443 parts In-Stock

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$0.828

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AZTECH Wire

Italy . 469 parts In-Stock

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$8.427

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Aztec Data Supply Inc.

USA . 295 parts In-Stock

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$12.450

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Kulean Microsystems

USA . 7,948 parts In-Stock

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TANS Electronics

Latvia . 7,402 parts In-Stock

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Problanco Electronics

Mexico . 5,412 parts In-Stock

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SupplyDigital Components

Austria . 3,724 parts In-Stock

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Continental Prestige Electronics

USA . 1,453 parts In-Stock

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Argo Parts USA

USA . 912 parts In-Stock

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UHIMA Technologies

Türkiye . 458 parts In-Stock

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Perfect Parts

USA . 235 parts In-Stock

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Microchip USA

USA . 216 parts In-Stock

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Bastille Electronics

Australia . 74 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the LV8762T-MPB-H by Onsemi, a leading manufacturer in the industry. Designed for a wide range of applications in the category of Peripheral Drivers, this product stands out for its built-in protections against transient events, over current, and thermal issues. With a maximum supply voltage of 32V and a compact package shape, this peripheral driver offers exceptional value and benefits to customers seeking efficient and durable solutions. Trust Onsemi for innovative technology that delivers superior performance and peace of mind in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

These protections help safeguard the peripheral driver and connected devices from potential damage due to voltage fluctuations, overloads, and overheating.

Maximum Seated Height: 1.2 mm

The low profile design allows for easy integration into compact electronic devices or systems.

Nominal Supply Voltage: 24 V

This voltage level makes the peripheral driver compatible with a wide range of applications and power sources.

Turn-on Time: 0.75 us

The quick turn-on time ensures fast response and efficient operation of the peripheral driver.

Output Current Flow Direction: SOURCE AND SINK

This feature allows the peripheral driver to control both sourcing and sinking of current, providing versatility in driving various types of loads.

Technical Specifications

Peripheral Drivers LV8762T-MPB-H attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

9 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Turn-off Time:

.75 us

Turn-on Time:

.75 us

Width:

4.4 mm

Trade Compliance

LV8762T-MPB-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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