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LV5068V-TLM-H

Onsemi

LV5068V-TLM-H by Onsemi

Switching Regulator or Controllers; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,621 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

6,621

-

$1.560

$1.390

$1.310

Verical

USA . 4,994 parts In-Stock

1+ parts

-

100+ parts

-

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$1.738

10k+ parts

$1.637

4,994

-

-

$1.738

$1.637

Arrow

USA . 98 parts In-Stock

1+ parts

-

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$1.449

98

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-

$1.449

Distributors (In-Stock)

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Digiode

USA . 266 parts In-Stock

1+ parts

$2.451

100+ parts

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266

$2.451

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Chip Stock

USA . 57,000 parts In-Stock

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57,000

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Vyrian

USA . 5,095 parts In-Stock

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5,095

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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100

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Distributors (Availability)

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Corohmni

South Africa . 496 parts In-Stock

1+ parts

$1.449

100+ parts

-

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496

$1.449

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Corphita

USA . 1,164 parts In-Stock

1+ parts

$2.322

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1,164

$2.322

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AZTECH Wire

Italy . 1,157 parts In-Stock

1+ parts

$13.870

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1,157

$13.870

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$18.037

100+ parts

$16.414

1k+ parts

$14.790

10k+ parts

-

60

$18.037

$16.414

$14.790

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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SupplyDigital Components

Austria . 7,652 parts In-Stock

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Perfect Parts

USA . 2,464 parts In-Stock

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TANS Electronics

Latvia . 2,152 parts In-Stock

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Problanco Electronics

Mexico . 1,541 parts In-Stock

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1,541

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Kulean Microsystems

USA . 581 parts In-Stock

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581

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Microchip USA

USA . 193 parts In-Stock

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193

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UHIMA Technologies

Türkiye . 158 parts In-Stock

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158

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Technical Specifications

Switching Regulators & Controllers LV5068V-TLM-H attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.00008 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

2200 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV5068V-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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