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LV5061V

Onsemi

LV5061V by Onsemi

LV5061V by Onsemi is a 16-terminal switching regulator with max output current of 0.005A and max switching frequency of 380kHz. Ideal for industrial applications, it operates b/w -40 to 85 °C in voltage-mode control, featuring BICMOS technology and Gull Wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 297 parts In-Stock

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Vyrian

USA . 210 parts In-Stock

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210

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TANS Electronics

Latvia . 3,756 parts In-Stock

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3,756

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Kulean Microsystems

USA . 3,715 parts In-Stock

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SupplyDigital Components

Austria . 3,296 parts In-Stock

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Problanco Electronics

Mexico . 2,910 parts In-Stock

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Corphita

USA . 2,003 parts In-Stock

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UHIMA Technologies

Türkiye . 655 parts In-Stock

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655

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Corohmni

South Africa . 73 parts In-Stock

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Overview

Unleash the power of efficient energy management with the LV5061V by Onsemi. Crafted with precision and expertise, this switching regulator offers unparalleled performance and reliability in a compact, sleek design. Ideal for a wide range of applications, from industrial automation to consumer electronics, the LV5061V ensures optimal power delivery with minimal energy wastage. Experience seamless operation and improved efficiency with this cutting-edge product, designed to meet the highest standards of quality and innovation. Elevate your projects with the LV5061V and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing overall product size.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on PCBs, contributing to a more organized and space-saving layout.

No. of Terminals: 16

With a high number of terminals, this product offers versatile connectivity options and compatibility with various circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product's reliability and performance even in elevated temperature environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, allowing for stable and efficient power delivery to connected devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product remains functional even in cold environments, making it suitable for a wide range of applications.

Maximum Output Current: 0.005 A

Although the maximum output current is relatively low, it is suitable for applications that require low power consumption and precise current control.

Technology: BICMOS

The use of BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Technical Specifications

Switching Regulators & Controllers LV5061V attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

380 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV5061V Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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