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LV47002P

Onsemi

LV47002P by Onsemi

LV47002P by Onsemi is an audio amplifier IC with 4 functions, operating at temperatures from -40 to 85 °C. It has a power supply of 14.4V and a max supply current of 400mA. This rectangular package with 25 terminals is ideal for industrial audio and video amplifier applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,596 parts In-Stock

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1,596

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Digiode

USA . 809 parts In-Stock

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809

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Kulean Microsystems

USA . 7,512 parts In-Stock

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7,512

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Problanco Electronics

Mexico . 6,550 parts In-Stock

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6,550

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TANS Electronics

Latvia . 6,169 parts In-Stock

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6,169

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Corphita

USA . 880 parts In-Stock

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880

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UHIMA Technologies

Türkiye . 836 parts In-Stock

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836

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SupplyDigital Components

Austria . 564 parts In-Stock

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Corohmni

South Africa . 264 parts In-Stock

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Overview

Elevate your audio and video experience with the LV47002P by Onsemi. Known for their top-quality products, Onsemi brings you a versatile audio amplifier that offers unparalleled performance in a compact package. With 4 functions packed into this rectangular-shaped device, this industrial-grade amplifier ensures optimal sound quality and reliability. Whether you're looking to upgrade your home entertainment system or enhance your car audio setup, the LV47002P is the perfect choice. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

No. of Functions: 4

Having multiple functions in a single device offers versatility and convenience, allowing the user to perform various tasks efficiently.

Package Shape: RECTANGULAR

The rectangular package shape helps in easier integration into electronic systems and provides a compact design for space-saving installations.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier, this product amplifies sound signals effectively, enhancing audio quality and improving the overall listening experience.

Power Supplies (V): 14.4

The 14.4V power supply allows for strong and efficient amplification of audio signals, providing clear and crisp sound output.

No. of Terminals: 25

Having 25 terminals offers flexibility in connecting various components and peripherals, making it suitable for complex audio setups.

Package Style (Meter): IN-LINE

The in-line package style ensures easy installation and connection, enhancing user convenience and reducing the complexity of wiring.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand heat and operate efficiently even under challenging conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C makes the product suitable for use in extreme cold environments without compromising performance.

Terminal Position: ZIG-ZAG

The zig-zag terminal position provides a stable connection and reduces the chance of disconnection, ensuring reliable performance.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the product is built to withstand tough industrial environments, making it highly durable and reliable for long-term use.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure connections and easy soldering, ensuring a stable and reliable electrical connection.

Maximum Supply Current: 400 mA

The high maximum supply current of 400 mA ensures sufficient power delivery for the amplification process, leading to optimal audio performance.

Terminal Pitch: 1 mm

Having a terminal pitch of 1 mm allows for precise and compact connections, enhancing the durability and reliability of the product.

Technical Specifications

Audio & Video Amplifiers LV47002P attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T25

No. of Functions:

4

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP25,.16,.16,40

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

400 mA

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LV47002P General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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