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LM337AT

Onsemi

LM337AT by Onsemi

ADJUSTABLE NEGATIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Technology: BIPOLAR; No. of Outputs: 1;

Median Price

$0.558

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 689 parts In-Stock

1+ parts

$0.270

100+ parts

-

1k+ parts

-

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689

$0.270

-

-

-

Farnell

UK . 724 parts In-Stock

1+ parts

$0.558

100+ parts

$0.301

1k+ parts

$0.243

10k+ parts

$0.222

724

$0.558

$0.301

$0.243

$0.222

Element14

Singapore . 724 parts In-Stock

1+ parts

$0.966

100+ parts

$0.521

1k+ parts

$0.421

10k+ parts

$0.385

724

$0.966

$0.521

$0.421

$0.385

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 943 parts In-Stock

1+ parts

$0.258

100+ parts

-

1k+ parts

-

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943

$0.258

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-

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Vyrian

USA . 4,831 parts In-Stock

1+ parts

-

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4,831

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MISTER SPROCKETS

USA . 98 parts In-Stock

1+ parts

-

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98

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,766 parts In-Stock

1+ parts

$0.245

100+ parts

-

1k+ parts

-

10k+ parts

-

1,766

$0.245

-

-

-

Corohmni

South Africa . 388 parts In-Stock

1+ parts

$0.274

100+ parts

-

1k+ parts

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388

$0.274

-

-

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Problanco Electronics

Mexico . 8,205 parts In-Stock

1+ parts

-

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8,205

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-

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SupplyDigital Components

Austria . 6,752 parts In-Stock

1+ parts

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6,752

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Kulean Microsystems

USA . 5,236 parts In-Stock

1+ parts

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5,236

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TANS Electronics

Latvia . 3,547 parts In-Stock

1+ parts

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3,547

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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509

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Metaverse IC Inc.

Canada . 190 parts In-Stock

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190

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Technical Specifications

Adjustable Regulators - Negative Single Output Standard LM337AT attributes and parameters. Explore more Adjustable Regulators - Negative Single Output Standard devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Input-Output Voltage Differential:

40 V

Minimum Input-Output Voltage Differential:

3 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

0 Cel

Maximum Output Current-1:

1.5 A

Maximum Output Voltage-1:

37 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1TB

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

LM337AT Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5963-01-509-2331, 5963015092331

NIIN

015092331

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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