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LC11014-241

Onsemi

LC11014-241 by Onsemi

LC11014-241 by Onsemi is a Display Controller with 144 terminals, operating at 3.3V. It features CMOS technology, GULL WING terminals, and a max supply current of 170mA. Ideal for commercial applications requiring a temperature range of 0-70 °C in a square-shaped package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,152 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 7,009 parts In-Stock

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Problanco Electronics

Mexico . 4,290 parts In-Stock

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Corphita

USA . 633 parts In-Stock

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UHIMA Technologies

Türkiye . 522 parts In-Stock

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Kulean Microsystems

USA . 333 parts In-Stock

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Corohmni

South Africa . 315 parts In-Stock

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TANS Electronics

Latvia . 132 parts In-Stock

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Overview

Enhance your display experience with the LC11014-241 by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This display controller is perfect for a wide range of applications, providing seamless integration and exceptional performance. With its advanced technology and innovative design, the LC11014-241 offers unparalleled value, benefits, and advantages to customers. Upgrade your display solutions today with Onsemi's LC11014-241.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the assembly process.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, making the product suitable for compact designs.

Power Supplies (V): 3.3

Operates on a standard power supply voltage of 3.3V, making it compatible with a wide range of systems.

No. of Terminals: 144

144 terminals provide ample connectivity options, allowing for versatile integration into different applications.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile design, ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70 °C ensures reliable performance in a variety of environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0 °C allows the product to function in cold conditions without issues.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, enhancing the reliability of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable performance.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and robust electrical connections, making the product durable and reliable.

Maximum Supply Current: 170 mA

Maximum supply current of 170mA ensures stable operation without drawing excessive power.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V is common in many systems, making the product compatible with a wide range of applications.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm allows for high-density mounting, enabling efficient use of board space.

Technical Specifications

Display Controllers LC11014-241 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Maximum Supply Current:

170 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC11014-241 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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