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LA4708N

Onsemi

LA4708N by Onsemi

LA4708N by Onsemi is a 2-function audio amplifier IC with 18 terminals. It operates b/w -35 °C to 85°C, with a power supply of 13.2V and max current of 250mA. Ideal for audio and video amplification applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,113 parts In-Stock

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Digiode

USA . 906 parts In-Stock

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906

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TANS Electronics

Latvia . 7,880 parts In-Stock

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7,880

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SupplyDigital Components

Austria . 7,187 parts In-Stock

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Problanco Electronics

Mexico . 4,994 parts In-Stock

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Kulean Microsystems

USA . 1,788 parts In-Stock

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Corphita

USA . 1,173 parts In-Stock

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Corohmni

South Africa . 140 parts In-Stock

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UHIMA Technologies

Türkiye . 55 parts In-Stock

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Overview

Enhance your audio experience with the LA4708N by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that deliver exceptional performance. The LA4708N falls under the category of Audio & Video Amplifiers, making it ideal for various applications such as home entertainment systems, automotive sound systems, and more. With its innovative design and reliable functionality, this product offers customers unmatched value, benefits, and advantages. Upgrade your audio setup today with the LA4708N and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

No. of Functions: 2

Having 2 functions allows for more versatility and options in audio amplification, providing users with a customizable experience.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output, making it a reliable choice for audio enthusiasts.

Power Supplies (V): 13.2

The power supply of 13.2V provides sufficient voltage for optimal performance, ensuring that the amplifier operates efficiently without risking damage.

No. of Terminals: 18

With 18 terminals, the amplifier can support a variety of connections and configurations, making it versatile and adaptable for different setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the amplifier to withstand extended use without overheating or performance issues.

Minimum Operating Temperature: -35 °C

The low minimum operating temperature of -35 °C ensures that the amplifier can still function in cold environments, increasing its usability range.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the chances of wiring errors, making it user-friendly and convenient.

Maximum Supply Current: 250 mA

With a maximum supply current of 250 mA, the amplifier can deliver consistent power output without exceeding its capabilities, ensuring stable performance.

Terminal Pitch: 1.98 mm

The small terminal pitch of 1.98 mm allows for compact and space-efficient designs, making the amplifier suitable for applications where size is a factor.

Technical Specifications

Audio & Video Amplifiers LA4708N attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-35 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP18,.09,78

Power Supplies (V):

13.2

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

250 mA

Surface Mount:

NO

Temperature Grade:

Terminal Pitch:

1.98 mm

Terminal Position:

SINGLE

Trade Compliance

LA4708N General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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