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LA42052

Onsemi

LA42052 by Onsemi

LA42052 by Onsemi is an audio amplifier IC with 18V power supply, 13 terminals, and operating temperatures from -25 °C to 70°C. It is designed for audio and video amplification applications, featuring a plastic/epoxy package body material and bipolar technology for optimal performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 2,301 parts In-Stock

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Digiode

USA . 707 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 500 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Problanco Electronics

Mexico . 7,048 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,905 parts In-Stock

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TANS Electronics

Latvia . 2,791 parts In-Stock

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Kulean Microsystems

USA . 2,653 parts In-Stock

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UHIMA Technologies

Türkiye . 835 parts In-Stock

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Corphita

USA . 712 parts In-Stock

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Corohmni

South Africa . 461 parts In-Stock

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Overview

The LA42052 by Onsemi is a top-quality audio amplifier designed to enhance your audio and video experience. Onsemi, known for their superior manufacturing standards, ensures that this product meets the highest industry benchmarks. Whether you're looking to upgrade your home entertainment system or boost the sound quality of your car stereo, the LA42052 delivers crystal-clear audio performance. With its reliable power supply and durable plastic/epoxy package body material, this amplifier is built to last. Say goodbye to distorted sound and hello to an immersive listening experience with the LA42052.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the amplifier lightweight and durable, enhancing its portability and longevity.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output, making it a suitable choice for audio applications requiring clear and crisp sound.

Power Supplies (V): 18

Operating at 18 volts provides sufficient power for the amplifier to deliver robust performance and drive speakers effectively.

No. of Terminals: 13

The ample number of terminals allow for versatile connectivity options, accommodating various input and output configurations for different audio setups.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the amplifier can withstand prolonged use without overheating, ensuring reliability in various environments.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25 °C makes the amplifier suitable for use in cold environments or during winter months.

Terminal Position: SINGLE

The single terminal position simplifies installation and wiring, making it easier for users to set up and connect the amplifier in their audio systems.

Technology: BIPOLAR

Utilizing bipolar technology helps in achieving high-speed performance and low distortion, ensuring accurate and faithful reproduction of audio signals.

Maximum Supply Current: 100 mA

With a maximum supply current of 100 mA, the amplifier operates efficiently without drawing excessive power, making it energy-efficient and cost-effective in the long run.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy integration with compatible connectors and components, facilitating seamless connectivity within audio setups.

Technical Specifications

Audio & Video Amplifiers LA42052 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Terminals:

13

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP13,.05,79

Power Supplies (V):

18

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

100 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

LA42052 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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