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HCPL2601M

Onsemi

HCPL2601M by Onsemi

LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Maximum On State Current: .025 A; Nominal Data Rate: 10 MBps;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,815 parts In-Stock

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Digiode

USA . 1,757 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 640 parts In-Stock

1+ parts

$65.075

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$62.472

640

$65.075

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$62.472

Northwest PG Solutions

USA . 328 parts In-Stock

1+ parts

$71.582

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328

$71.582

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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Kulean Microsystems

USA . 6,971 parts In-Stock

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Problanco Electronics

Mexico . 2,872 parts In-Stock

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Corphita

USA . 2,485 parts In-Stock

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SupplyDigital Components

Austria . 1,889 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,680 parts In-Stock

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1,680

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Alle Elektronik GmbH

Germany . 1,120 parts In-Stock

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Supply Digital

USA . 1,065 parts In-Stock

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Corohmni

South Africa . 472 parts In-Stock

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472

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TANS Electronics

Latvia . 295 parts In-Stock

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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285

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Technical Specifications

Optocoupler Circuit Outputs HCPL2601M attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Nominal Data Rate:

10 MBps

Maximum Forward Current:

.05 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.025 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Maximum Response Time:

.0000001 s

Nominal Response Time:

40 ns

Shape:

RECTANGULAR

Minimum Supply Voltage:

4.5 V

Trade Compliance

HCPL2601M Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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