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HCPL0701R2V

Onsemi

HCPL0701R2V by Onsemi

HCPL0701R2V by Onsemi is a single optocoupler with max. forward current of 0.02A and max. isolation voltage of 2500V. Ideal for logic IC output applications, it operates b/w -40°C to 85°C, with a max. on-state current of 0.06A, featuring matte tin terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,499 parts In-Stock

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2,499

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Vyrian

USA . 675 parts In-Stock

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675

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Aztec Data Supply Inc.

USA . 1,478 parts In-Stock

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$0.130

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$0.130

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Semicontronic

India . 1,200 parts In-Stock

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$9.100

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$8.872

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$8.827

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$8.827

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Ampacity Inc.

Singapore . 307 parts In-Stock

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$11.100

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307

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AZTECH Wire

Italy . 257 parts In-Stock

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$15.308

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257

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QUARKTWIN TECHNOLOGY LTD

USA . 11,579 parts In-Stock

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Problanco Electronics

Mexico . 7,721 parts In-Stock

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Kulean Microsystems

USA . 5,525 parts In-Stock

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TANS Electronics

Latvia . 5,488 parts In-Stock

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Continental Prestige Electronics

USA . 2,567 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Corphita

USA . 1,901 parts In-Stock

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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SupplyDigital Components

Austria . 1,457 parts In-Stock

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Argo Parts USA

USA . 744 parts In-Stock

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UHIMA Technologies

Türkiye . 507 parts In-Stock

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Supply Digital

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Bastille Electronics

Australia . 100 parts In-Stock

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Corohmni

South Africa . 51 parts In-Stock

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Overview

Unleash the power of precision with the HCPL0701R2V by Onsemi. Crafted with expertise and excellence, this optocoupler circuit output device is designed to elevate your applications to new heights. From enhancing signal isolation to improving noise immunity, this product delivers unparalleled performance and reliability. Whether you're in the automotive, industrial, or telecommunications industry, the HCPL0701R2V offers unmatched value and benefits that will set you apart from the competition. Trust Onsemi for quality you can rely on.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to use and implement in various circuit designs.

Maximum Forward Current: 0.02 A

Can handle a maximum forward current of 0.02 A, providing sufficient power for the circuit.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Optocoupler designed for logic IC output applications, ensuring compatibility with digital circuits.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85°C, suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

Can operate at temperatures as low as -40°C, making it suitable for both cold and hot conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good connectivity and resistance to corrosion.

Maximum Isolation Voltage: 2500 V

Offers a high isolation voltage of 2500 V, providing protection against voltage spikes and noise.

Maximum On State Current: 0.06 A

Capable of handling a maximum on-state current of 0.06 A, ensuring reliable performance in high-power applications.

Technical Specifications

Optocoupler Circuit Outputs HCPL0701R2V attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

2500 V

JESD-609 Code:

e3

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.06 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Terminal Finish:

Trade Compliance

HCPL0701R2V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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